Cu@Ag包覆粉体的SPS烧结及其致密机理研究  

SPS Sintering of Cu@Ag Coated Powder and Its Dense Mechanism

作　　者：罗国强[1] 吕时俊 李远 胡家念 张建[1] 孙一 沈强[1] Luo Guoqiang;Lv Shijun;Li Yuan;Hu Jianian;Zhang Jian;Sun Yi;Shen Qiang(State Key Laboratory of Advanced Technology for Materials Synthesis and Processing,Wuhan University of Technology,Wuhan 430070,China)

机构地区：[1]武汉理工大学材料复合新技术国家重点实验室,湖北武汉430070

出　　处：《稀有金属材料与工程》2021年第1期286-290,共5页Rare Metal Materials and Engineering

基　　金：国家自然科学基金重点项目(51932006);国家自然科学基金创新群体项目(51521001);联合基金项目(6141A02022255);湖北省技术创新专项重大项目(2019AFA176);“111”计划。

摘　　要：采用化学镀法制备Cu@Ag包覆粉体,并利用放电等离子烧结技术(SPS)对其进行烧结,利用扫描电子显微镜、透射电子显微镜研究包覆粉体、烧结样品的微观结构,对烧结样品的物相、致密度及其致密化机理进行表征与分析。结果表明,化学镀法制备的Cu@Ag粉体表面存在高纯的包覆层。在较低的烧结温度下可以得到致密度高的Cu-Ag烧结块体,温度升高,Cu-Ag烧结块体的致密度逐渐升高,550℃时,致密度达到极大值96.76%。分析认为,得益于Cu@Ag粉体的包覆结构,在低温下,铜颗粒表面的纳米银的颈缩促进了烧结;在高温下,Cu、Ag间的固溶进一步促进了烧结。Cu@Ag coated powder was prepared by electroless plating and sintered by spark plasma sintering(SPS)technology.The scanning electron microscope and transmission electron microscope were used to study the microstructure of the coated powder and sintered samples.The phases and densities of the samples were characterized.The results show that there is obvious coating on the surface of Cu@Ag powder prepared by electroless plating.A high-density Cu-Ag sintered block can be obtained using SPS.At 550℃,the density reaches a maximum of 96.76%.At low temperatures,the necking of nano-silver promotes the sintering;at high temperatures,solid solution between Cu and Ag promotes sintering.

关 键 词：Cu@Ag 化学镀 放电等离子烧结 致密度 

分 类 号：TF124[冶金工程—粉末冶金]