热循环对Sn58Bi-0.1Ti/Cu焊点界面与性能影响  

Effect of Thermal Cycling on Interface and Properties of Sn58Bi(nano Ti)/Cu Solder Joints

作　　者：姜楠 张亮 孙磊[3] 王凤江[4] 龙伟民[5] 钟素娟[5] Jiang Nan;Zhang Liang;Sun Lei;Wang Fengjiang;Long Weimin;Zhong Sujuan(School of Mechanical&Electrical Engineering,Jiangsu Normal University,Xuzhou 221116,China;State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001,China;National Key Laboratory of Science and Technology on Helicopter Transmission,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;School of Materials Science and Engineering,Jiangsu University of Science and Technology,Zhenjiang 212000,China;State Key Laboratory of Advanced Brazing Filler Metals&Technology,Zhengzhou Research Institute of Mechanical Engineering,Zhengzhou 450001,China)

机构地区：[1]江苏师范大学机电工程学院,江苏徐州221116 [2]哈尔滨工业大学先进焊接与连接国家重点实验室,黑龙江哈尔滨150001 [3]南京航空航天大学直升机传动技术国家重点实验室,江苏南京210016 [4]江苏科技大学材料科学与工程学院,江苏镇江212000 [5]郑州机械研究所新型钎焊材料与技术国家重点实验室,河南郑州450001

出　　处：《稀有金属材料与工程》2021年第1期327-332,共6页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(51475220);先进焊接与连接国家重点实验室开放课题重点项目(AWJ-19Z04);江苏省“六大人才高峰”资助项目(XCL-022)。

摘　　要：为了改善Sn58Bi低温钎料的性能,通过在Sn58Bi低温钎料中添加质量分数为0.1%的纳米Ti颗粒制备了Sn58Bi-0.1Ti纳米增强复合钎料。研究了纳米Ti颗粒的添加对-55~125℃热循环过程中Sn58Bi/Cu焊点的界面金属间化合物(IMC)生长行为的影响。结果表明:回流焊后,在Sn58Bi/Cu焊点和Sn58Bi-0.1Ti/Cu焊点的界面处都形成一层扇贝状的Cu_(6)Sn_(5)IMC层。在热循环300次后,在Cu_(6)Sn_(5)/Cu界面处形成了一层Cu3Sn IMC。Sn58Bi/Cu焊点和Sn58Bi-0.1Ti/Cu焊点的IMC层厚度均和热循环时间的平方根呈线性关系。但是,Sn58Bi-0.1Ti/Cu焊点的IMC层厚度明显低于Sn58Bi/Cu焊点,这表明纳米Ti颗粒的添加能有效抑制热循环过程中界面IMC的过度生长。另外计算了这2种焊点的IMC层扩散系数,结果发现Sn58Bi-0.1Ti/Cu焊点的IMC层扩散系数(整体IMC、Cu_(6)Sn_(5)和Cu3Sn IMC)明显比Sn58Bi/Cu焊点小,这在一定程度上解释了Ti纳米颗粒对界面IMC层生长的抑制作用。In order to improve the performance of Sn58Bi lead-free solder,the Sn58Bi-0.1Ti nanometer reinforced composite solder was prepared by incorporating 0.1 wt%Ti nanoparticles into the Sn58Bi solder.In this research,the effect of adding Ti nanoparticles on the growth behavior of intermetallic compounds(IMC)in Sn58Bi/Cu solder joints during thermal cycling was studied.The results show that a scallop-like Cu_(6)Sn_(5) IMC layer forms at Sn58Bi/Cu and Sn58Bi-0.1Ti/Cu interface after reflow soldering.After 300 thermal cycles,a layer of Cu3Sn IMC forms at the Cu_(6)Sn_(5)/Cu interface.The thickness of IMC layer of Sn58Bi/Cu and Sn58Bi-0.1Ti/Cu solder joint is proportional to the square of thermal cycling times.However,the IMC layer thickness of Sn58Bi-0.1Ti/Cu solder joint is significantly lower than that of Sn58B/Cu solder joint,which indicates that the addition of Ti nanoparticles can effectively inhibit the excessive growth of interfacial IMC during the thermal cycle process.In addition,the IMC layer diffusion coefficients of these two solder joints are calculated,and the diffusion coefficients of IMC layer in Sn58Bi-0.1Ti/Cu solder joint(overall IMC,Cu_(6)Sn_(5) and Cu3Sn IMC)are smaller those that of Sn58Bi/Cu solder joint,which explains the inhibitory effect of Ti nanoparticles on the interface IMC layer to some extent.

关 键 词：Sn58Bi无铅钎料 Ti纳米颗粒 界面反应 热循环 扩散系数 

分 类 号：TG425[金属学及工艺—焊接]