基于高功率密度芯片应用的微流道散热研究  

Research on Microchannel Heat Dissipation Based on High Power Density Chip Application

作　　者：刘鹏辉 苏梅英[2,3] 李君 周鸣昊 LIU Peng-hui;SU Mei-ying;LI Jun;ZHOU Ming-hao(University of Chinese Academy of Sciences,Beijing 100049,China;不详)

机构地区：[1]中国科学院大学,微电子学院,北京100049 [2]中国科学院微电子研究所,北京100029 [3]华进半导体封装先导技术研发中心有限公司,江苏无锡214135

出　　处：《电力电子技术》2021年第1期129-132,共4页Power Electronics

基　　金：国家自然科学基金(U1730143)

摘　　要：为了解决高功率密度芯片的散热问题,设计了3种微流道液冷板,分别为平直翅片液冷板和2种分段翅片液冷板,利用ANSYS Fluent软件比较它们的散热特性,研究发现平直翅片液冷板散热效果最好。对影响液冷板散热性能的因素(进口水温、进口流速、环境温度)进行了仿真分析,通过正交实验设计,研究了这3种因素对散热性能的影响程度。结果表明,上述因素对散热性能影响程度的主次顺序为:进口水温>进口流速>环境温度,为高功率密度芯片的散热设计提供了参考依据。In order to solve the heat dissipation problem of high power density chips,three microchannel liquid-cooled plates are designed,which are the flat fin liquid-cooled plates and two segmented fin liquid-cooled plates.Their thermal characteristics are compared using ANSYS Fluent,the study finds that the flat fin liquid-cooled plate has the best heat dissipation effect.The factors affecting the heat dissipation performance of the liquid-cooled plate(inlet water temperature,inlet velocity,and ambient temperature) are simulated and analyzed,and the degree of influence of these three factors on the heat dissipation performance is studied through orthogonal experiment design.The results show that the order of influence of the above factors on the heat dissipation performance is inlet water temperature>inlet flow rate>ambient temperature,which provides a reference basis for the heat dissipation design of high power density chips.

关 键 词：高功率密度芯片 微流道 仿真 散热 

分 类 号：TN406[电子电信—微电子学与固体电子学]