单颗磨粒划擦SiCf/SiC陶瓷基复合材料的试验研究  

Experimental research on single abrasive grain scratchSiCf/SiC ceramic matrix composite

作　　者：周雯雯 王建青[1] 赵晶 刘瑶 ZHOU Wenwen;WANG Jianqing;ZHAO Jing;LIU Yao(School of Mechanical Engineering, North University of China, Taiyuan 030051, China)

机构地区：[1]中北大学机械工程学院,太原030051

出　　处：《金刚石与磨料磨具工程》2021年第1期51-57,共7页Diamond & Abrasives Engineering

基　　金：国家自然科学基金项目(51905498);中北大学第十六届研究生科技立项资助(20191610)。

摘　　要：为研究SiC纤维(SiCf)增强SiC陶瓷基复合材料(SiCf/SiC)的磨削损伤机理,搭建试验平台开展单颗磨粒划擦试验,测量划擦力并观察其表面损伤形式,研究磨粒形状、划痕深度和SiCf取向对复合材料磨削机理的影响。试验结果表明:SiCf/SiC陶瓷基复合材料的划擦损伤形式主要有基体崩碎、纤维裂纹、断裂和拔出等。在SiCf/SiC陶瓷基复合材料划擦过程中,尖锐状磨粒的划擦力更小,且整条划痕的表面损伤范围较扁平状磨粒的小。用扁平状磨粒划擦但纤维取向γ=0°时,划痕形貌中纤维断裂、纤维拔出等损伤形式出现较少。To study the mechanism of SiC fiber(SiCf)reinforced SiC ceramic matrix composite(SiCf/SiC)grinding damage,a test platform was built to carry out single abrasive particle scratch tests.The scratch force was measured and the surface damage form was observed.The influence of shape of the abrasive particle,scratch depth and SiCf orientation on the grinding mechanism was studied.The test results show that the scratch damage of SiCf/SiC mainly includes matrix collapse,extension,cracks,fractures and pullouts of fiber.In the process of scratching SiCf/SiC composite material,the scratching force of sharp abrasive particles is smaller,and the surface damage range of the entire scratch caused by sharp abrasive is smaller than that of the scratch caused by flat abrasive particles.However,when the flat abrasive particles are scratching and the fiber orientation isγ=0°,there are fewer damages such as fiber fracture and fiber pull-out in the scratched morphology.

关 键 词：单颗磨粒划擦 SiCf/SiC陶瓷基复合材料 纤维取向 划擦力 表面形貌 

分 类 号：TG58[金属学及工艺—金属切削加工及机床] V257[一般工业技术—材料科学与工程]