湿热试验后铭牌表面“麻点”原因分析及对策  

Cause Analysis and Countermeasures of Pockmarks on Nameplate Surface after Humid Heat Test

作　　者：刘伟 舒伟发 朱海青 黄昭富 邹亚军 朱君强 LIU Wei;SHU Weifa;ZHU Haiqing;HUANG Zhaofu;ZHOU Yajun;ZHU Junqiang(The Second Military Representative Office of Air Force Armament Department Statroned in Nanjing,Nanjing 11106,China;8511 Research Institute of China Aerospace Science and Industry Corporation,Nanjing 11106,China)

机构地区：[1]空军装备部驻南京地区第二军事代表室,江苏南京211106 [2]中国航天科工集团八五一一研究所,江苏南京211106

出　　处：《电子产品可靠性与环境试验》2021年第1期27-31,共5页Electronic Product Reliability and Environmental Testing

摘　　要：针对某电子产品铭牌湿热试验后,表面出现麻点的质量问题,利用SEM对其进行了分析,绘制了湿热试验后铭牌表面三防漆膜出现麻点的故障树,列出了可能导致起泡的原因,并逐条对原因进行了分析。结果表明,出现麻点是铭牌表面清漆膜起泡造成的;由于清漆与铭牌底漆不匹配,并且刷涂第一遍清漆后烘烤时间不够是造成出现麻点的主要原因,将刷涂第一遍后的烘烤时间由原来的4 h延长至16 h,湿热试验后没有出现麻点现象。Aiming at the quality problem of pitting on the surface of an electronic product nameplate after humid heat test,the SEM is used to analyze it,and the fault tree of the three anti-paint film on the surface of the nameplate after humid heat test is drawn.The possible causes of foaming are listed and analyzed one by one.The results show that the pitting is caused by the blistering of the varnish film on the surface of the nameplate,and the main reason is that the varnish does not match the primer of the nameplate and the baking time after brushing the first varnish is not enough.When the baking time after brushing the first varnish is extended from the original 4 h to 6 h,there is no pitting after humid heat test.

关 键 词：湿热试验 三防漆膜 铭牌 起泡 

分 类 号：TG115.213[金属学及工艺—物理冶金]