不同气体流量比对Cu/a-C∶H复合薄膜结构及摩擦学性能的影响  

Effects of different gas flow ratio on structure and tribological properties of Cu/a-C∶H films

作　　者：孟杰[1] 田林海[1] 刘颖[1] 周兵[1] 吴玉程 于盛旺[1] 吴艳霞[1] Meng Jie;Tian Linhai;Liu Ying;Zhou Bing;Wu Yucheng;Yu Shengwang;Wu Yanxia(Institute of New Carbon Materials,Taiyuan University of Technology,Taiyuan Shanxi 030024,China)

机构地区：[1]太原理工大学新型碳材料研究院,山西太原030024

出　　处：《金属热处理》2021年第2期100-105,共6页Heat Treatment of Metals

基　　金：国家自然科学基金(51505318,51801133);山西省科技重大专项(20181102013);山西省“1331工程”工程研究中心项目(PT201801)。

摘　　要：采用磁控溅射技术结合等离子体气相沉积技术,通过调节CH4与Ar的气体流量比例,获得了不同Cu含量的Cu/a-C∶H复合薄膜。采用XPS、Raman等表征方法分析了不同气体流量比对Cu在复合薄膜中的存在形式及薄膜结构的影响,利用纳米压痕仪测量了复合薄膜的硬度与弹性模量,采用往复式摩擦磨损试验机、白光干涉仪、FESEM等分析了复合薄膜在空气中的摩擦学性能及相关机理。结果表明:随着CH4在混合气体中所占比例增加,复合薄膜中sp2C含量升高,Cu含量降低,Cu晶粒的尺寸变小,复合薄膜的硬度逐渐升高,韧性降低。CH4气体流量比为60%、Cu含量为6.68at%的复合薄膜具有较高的硬度、良好的韧性以及在空气中最低的摩擦因数(0.091)与磨损率(1.77×10^(-6)mm^(3)·N^(-1)·m^(-1)),这与复合薄膜中sp2C含量及Cu纳米粒子的尺寸和含量有关。Cu/a-C∶H thin films with different Cu contents were prepared by using magnetron sputtering technology combined with plasma vapor deposition technology with adjusting the gas flow ratio of CH4 and Ar.The effects of gas flow ratio on the existence form of Cu and on the structure of the composite films were analyzed by XPS,Raman and other characterization methods.The hardness and elastic modulus of the composite films were measured by nano indentation.The tribological properties and related mechanisms of the composite films in air were analyzed by reciprocating friction and wear tester,white-light interferometry and FESEM.The results show that with the increase of CH4 proportion in the mixed gas,the sp2 C content in the composite films increases,the content and grain size of Cu decrease,and the hardness of the composite films increases gradually,while the toughness decreases.Additionally,when the CH4 gas flow ratio is 60%and Cu content is 6.68 at%,the composite films are of high hardness,good toughness,and the lowest friction coefficient(0.091)and wear rate(1.77×10^(-6)mm^(3)·N^(-1)·m^(-1))in air,which are related to the content of sp2 C and the size and content of Cu nanoparticles in the composite films.

关 键 词：Cu/a-C∶H复合薄膜 气体流量比 力学性能 摩擦学性能 

分 类 号：TG174.442[金属学及工艺—金属表面处理]