基于半导体MZ调制器与DFB激光器混合集成的小型化光发射模块的设计与研究  

Design and research on small hybrid integrated transmitter module of semiconductor MZ modulator and DFB laser

作　　者：卢致远 熊兵[1] 罗毅[1] 孙长征[1] 余佳东 郝智彪[1] 王健[1] 汪莱[1] 韩彦军[1] 李洪涛[1] LU Zhi-yuan;XIONG Bing;LUO Yi;SUN Chang-zheng;YU Jia-dong;HAO Zhi-biao;WANG Jian;WANG Lai;HAN Yan-jun;LI Hong-tao(Beijing National Research Centre for Information Science and Technology,Department of Electronic Engineering,Isinghua University,Beijing 100084,China)

机构地区：[1]清华大学电子工程系,北京信息科学与技术国家研究中心,北京100084

出　　处：《光电子．激光》2021年第2期181-185,共5页Journal of Optoelectronics·Laser

基　　金：国家重点研究开发计划(2018YFB2201700);国家自然科学基金(61975093,61927811,61822404,61974080,61904093,61875104);清华大学自主科研计划(20193080036)资助项目。

摘　　要：针对半导体DFB激光器、铌酸锂MZ调制器采用分立封装形式且整体尺寸较大的问题,采用半导体MZ调制器和DFB激光器两类芯片并进行混合集成封装有望显著减小模块的整体尺寸。论文根据芯片和模块尺寸要求提出了一个整体布局结构,并选用双透镜加隔离器以及锥形透镜光纤光耦合方案和微带线转GCPW微波耦合方案。通过仿真计算,对模块中激光器与调制器混合集成设计的关键参数及容差进行了研究。本混合集成发射模块在尺寸结构小型化的同时,也可确保自身良好的稳定性与可靠性。To solve the problem of large overall size caused by discrete packaging of semiconductor DFB laser and LiNbO3 MZ modulator,the adoption of hybrid integrated packaging of semiconductor MZ modulaotor and DFB laser is expected to significantly reduce the overall size of the transmitter module.This paper proposes an overall layout structure according to the requirements of chip and module size,and chooses the optical coupling scheme of double lens with isolator and tapered lens fiber and the microwave coupling scheme of microstrip line to GCPW.Through simulation mothods,the key parameters and tolerance of hybrid integrated design of laser and modulator in the module are researched.The hybrid integrated transmitter module not only has miniaturized size and structure,but also ensures its own good stability and reliability.

关 键 词：DFB激光器 半导体MZ调制器 小型化 混合集成 

分 类 号：TN365[电子电信—物理电子学]