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作 者:杨璐 曹敏 曹玲飞[3] 廖斌[3] 王正安 YANG Lu;CAO Min;CAO Ling-fei;LIAO Bin;WANG Zheng-an(Southwest Aluminum(Group)Co.,Ltd.,Chongqing 401326,China;Equipment Research and Development Center,Beijing 100000,China;College of Materials Science and Engineering,Chongqing University,Chongqing 400044,China)
机构地区:[1]西南铝业(集团)有限责任公司,重庆401326 [2]装备发展部某中心,北京100000 [3]重庆大学材料科学与工程学院,重庆400044
出 处:《材料工程》2021年第3期78-86,共9页Journal of Materials Engineering
基 金:国家重点研发计划(2016YFB0300901);重庆市留创计划创新类项目(cx2018002);中央高校基本科研业务费(2020CDJDPT001)。
摘 要:利用热模拟实验研究7B04包铝复合板在变形温度为380~450℃和应变速率为0.1~30 s^(-1)的热压缩性能,结果表明:随着真应变的增加,热加工图失稳区逐渐向高应变速率区域扩展。最适宜的热加工区域为:温度380~410℃,应变速率5~30 s^(-1)。采用EBSD技术对变形后的组织进行表征,结果表明:随着温度的增加和应变速率的降低,再结晶晶粒趋向于晶界平直化及晶界取向差逐渐增加的方向演变。包铝层在变形过程中主要发生连续动态再结晶,而7B04基体中同时存在不连续动态再结晶、连续动态再结晶(含几何动态再结晶)。材料最佳的热变形温度为410℃和应变速率10 s^(-1),此时7B04基体和包铝层的晶粒尺寸均保持在较小的范围内。Hot compression properties of aluminium cladded 7 B04 composite sheets were investigated by thermal simulation testing at the deformation temperatures of 380-450℃and strain rates of 0.1-30 s^(-1).The results show that the instability zone of hot processing map gradually expands to the region of high strain rates with the increase of true strains.The most suitable hot working zone is at the temperature range of 380-410℃and strain rate of 5-30 s^(-1).Electron backscattered diffraction(EBSD)technique was employed to study the deformed microstructure.The results show that the recrystallized grains tend to have flat boundaries and the orientation difference between grain boundaries increases gradually with the increase of temperature and the decrease of strain rate.During deformation,the Al-clad layer shows mainly continuous dynamic recrystallization,while discontinuous dynamic recrystallization and continuous dynamic recrystallization(including geometric dynamic recrystallization)co-exist in the 7 B04 matrix.The optimal hot deformation temperature of materials are 410℃at the strain rate of 10 s^(-1),at this moment,the grain size of both 7 B04 matrix and Al cladding is close and small.
关 键 词:7B04复合板 热加工图 微观组织 再结晶机制 晶粒尺寸
分 类 号:TG146.2[一般工业技术—材料科学与工程]
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