Preface to the Special Issue on Beyond Moore:Three-Dimensional(3D)Heterogeneous Integration  

作　　者：Yue Hao Huaqiang Wu Yuchao Yang Qi Liu Xiao Gong Genquan Han Ming Li 

机构地区：[1]School of Microelectronics,Xidian University,Xi’an 710071,China [2]Institute of Microelectronics,Tsinghua University,Beijing 100084,China [3]Department of Micro/nanoelectronics,Peking University,Beijing 100871,China [4]Frontier Institute of Chip and System,Fudan University,Shanghai 200438,China [5]Department of Electrical and Computer Engineering,National University of Singapore,Singapore 117546,Singapore [6]Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,China

出　　处：《Journal of Semiconductors》2021年第2期1-2,共2页半导体学报（英文版）

摘　　要：In the past few decades,the Moore’s Law has been the revolutionary force for our integrated circuit(IC)industry.However,the tremendous challenges faced in continuous transistor physical down-scaling and the unprecedented demands for computing and storage capabilities require our urgent search for strategies and solutions to integrate diverse materials,devices,circuits,and architectures in a 3D vertically stacked manner so that they can orchestrate in the most effective way to provide significantly enhanced functionalities as well as superior speed,energy,bandwidth,form fact,and cost.

关 键 词：Integration SCALING INTEGRATE 

分 类 号：TN43[电子电信—微电子学与固体电子学]