镀铜膨胀石墨复合材料的制备与性能  

Preparation and properties of copper plated expanded graphite composites

作　　者：白琳 葛毅成[1] 朱林英 易茂中[1] 冉丽萍[1] Bai Lin;Ge Yi-cheng;Zhu Lin-ying;Yi Mao-zhong;Ran Li-ping(State Key Laboratory of Powder Metallurgy,Central South University,Hunan Changsha 410083,China)

机构地区：[1]中南大学粉末冶金国家重点实验室,湖南长沙410083

出　　处：《炭素技术》2020年第6期46-51,70,共7页Carbon Techniques

摘　　要：采用化学镀技术在膨胀石墨(EG)表面镀铜实现金属化。采用XRD、SEM、Raman等检测不同EG质量分数(8%、9%、10%、11%、12%、13%)镀铜粉末的微观结构和组织成分;采用SPS烧结技术制备了镀铜EG复合材料,并进行密度、硬度、导电性、摩擦磨损等性能的检测。结果表明:复合粉末继承了原始EG多串亚微粒蠕虫状结构,铜晶覆盖完全,镀层致密均匀,且颗粒内部存在大量纳米铜晶,拉曼光谱分析表明,铜优先在石墨化程度更高处附着。随着石墨含量的增加,镀层厚度减小,石墨含量高于12%时影响镀层的完整性。对复合粉末进行烧结,改善了EG在基体中的分布。当石墨含量为8%时,材料的致密度为96.3%,显微硬度为50.7(HV),电导率为5.34×107S/m,且拥有良好的摩擦磨损性能,摩擦机制以疲劳磨损为主,随着石墨含量的增加,样品的综合性能逐渐降低。The microstructure and constituents of copper plated expanded graphite(EG) with different graphite content(8%、9%、10%、11%、12%、13%)through chemical plating technique are investigated by using XRD, SEM, and Raman. The density, hardness,conductivity, friction and abrasion performance of the copper plated EG composite material prepared by SPS technique are tested.The results show that the composite powder inherits the EG’s multi-string submicron structure. After chemical plating, the expanded graphite is completely covered by copper crystals, and the plating layer is compact and uniform. A large amount of copper nanocrystals are formed inside the particles. Raman analysis shows that copper preferentially adheres to the place with a higher degree of graphitization. As the graphite content increases, the copper layer becomes thinner, and the graphite content higher than 12% affects the integrity of the plating layer. Sintering the composite powder improves the distribution of EG in the matrix. When the graphite content is 8%, the material shows the density of 96.3%, the microhardness of 50.7(HV), and the conductivity of 5.34×107 S/m, and has good friction and abrasion performance. The properties of the sample gradually decrease with increasing graphite content.

关 键 词：膨胀石墨 铜 化学镀 复合粉体 表面改性 SPS 

分 类 号：TB333[一般工业技术—材料科学与工程]