阶梯孔磨料流精密抛光数值模拟及其参数优化  

Numerical simulation and parameter optimization of stepped hole abrasive flow precision polishing

作　　者：闫如忠[1,2] 商成 王生泽 YAN Ruzhong;SHANG Cheng;WANG Shengze(College of Mechanical Engineering,Ministry of Education,Donghua University,Shaghai 201620,China;Engineering Research Center of Advanced Textile Machinery,Ministry of Education,Donghua University,Shaghai 201620,China)

机构地区：[1]东华大学机械工程学院,上海201620 [2]东华大学纺织装备教育部工程研究中心,上海201620

出　　处：《东华大学学报（自然科学版）》2021年第1期86-91,100,共7页Journal of Donghua University(Natural Science)

摘　　要：集群式阶梯孔零件在硅片加工中易损耗、精度要求高,磨削、铰孔等传统加工方法很难保证其加工精度,因此需采用磨料流抛光的方法进行精密加工。通过ANSYS仿真软件建立流体域模型,并进行集群式阶梯孔抛光效果和抛光方向的仿真;利用神经网络的计算方法实现了对入口压力、磨料体积分数和磨料粒径参数的优化,提高了集群式阶梯孔抛光精度的一致性和抛光效率。在抛光方法和参数优化上为试验的进行提供了理论依据和参考价值。Cluster-type stepped hole parts are easy to wear and belong to high precision parts in silicon wafer processing.Traditional processing methods such as grinding and reaming are difficult to ensure their processing accuracy.Therefore,it is necessary to use abrasive flow polishing methods for precision processing.The fluid domain model was established by ANSYS simulation software,and the cluster step hole polishing effect and polishing direction were simulated.The calculation method of neural network was used to realize the optimization of inlet pressure,abrasive volume fraction and abrasive particle size parameters.The consistency of polishing accuracy and polishing efficiency of cluster stepped holes were improved.The polishing method and parameter optimization could provide theoretical basis and reference value for the experiment.

关 键 词：阶梯孔 磨料流抛光 数值仿真 参数优化 

分 类 号：TH161.14[机械工程—机械制造及自动化]