铝合金封装用微矩形连接器气密焊接工艺  

Soldering Process of Micro-rectangular Connector for Aluminum Alloy Hermetic Packaging

作　　者：卢茜[1] 李阳阳[1] 张剑 董东[1] 景飞 高阳[1] 曾元祁 LU Qian;LI Yangyang;ZHANG Jian;DONG Dong;JING Fei;GAO Yang;ZENG Yuanqi(The 29th Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《电子工艺技术》2021年第2期66-69,共4页Electronics Process Technology

基　　金：十三五技术基础科研项目(JSZL2018210B009)。

摘　　要：铝合金是微波组件封装的优选材料,微距形连接器是高密度电子封装中的关键元器件。但是由于铝合金与柯伐外壳的微距形连接器之间存在严重热失配,导致封装不具备长期气密性。针对此问题,设计了四种集成微矩形连接器的铝合金封装方案,通过有限元分析、仿真分析和试验验证,制定了最佳的封装方案。Aluminum Alloy is the preferred material for microwave module packaging,while micro-rectangular connector is the key component for high density packaging.However,due to the thermal expansion mismatch between the aluminum alloy and the connectors with Kovar shell,the package does not have long-term air tightness.In order to solve this problem,four kinds of aluminum alloy packaging schemes with micro-rectangular connectors are designed.By using finite element analysis,simulation analysis and experimental verification,the optimal packaging scheme is developed.

关 键 词：微矩形连接器 铝合金封装 气密 有限元分析 

分 类 号：TN605[电子电信—电路与系统]