某波导组件连接器内导体焊接结构及工艺  

Soldering Structure and Process of RF Connector Inner Conductor of Wave Guide Module

作　　者：吴瑛 刘颖 陈该青[1] 许春停[1] 倪靖伟[1] WU Ying;LIU Ying;CHEN Gaiqing;XU Chunting;NI Jingwei(The 38th Research Institute of CETC,Hefei 230031,China)

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230031

出　　处：《电子工艺技术》2021年第2期99-101,105,共4页Electronics Process Technology

基　　金：十三五装备预先研究项目(41423070103)。

摘　　要：某毫米波波导组件壳体内部结构复杂,与射频连接器焊接时,内导体焊接部位处于深腔内不可见,易出现焊接质量问题。基于焊接结构工艺性设计及工艺优化,提出了一种深盲腔射频连接器内导体焊接结构及焊接方法,实现了深盲腔内内导体的通孔回流焊接,解决了焊接质量差的问题,满足了波导组件的高指标要求。The inner cavity structure of the metal shell of millimeter-wave wave guide is complex,and the RF connector inner conductor would be soldered in the deep cavity of the shell.Above all,it is easy to produce soldering quality problem,because the soldering position is invisible.Based on the design of soldering structure and process optimization,a new soldering structure and process method of RF connector inner conductor in the deep blind cavity is proposed,which achieves through-hole reflow soldering of RF connector inner conductor in the deep blind cavity,solves the problems of poor soldering quality,and meets the requirements of high electrical properties for wave guide module.

关 键 词：深盲腔 射频连接器内导体 焊接结构 工艺优化 

分 类 号：TN405[电子电信—微电子学与固体电子学]