底部涂层技术对镀银基板LED封装光源的性能影响  

The Effect of Bottom Coating Technology of LED Package on Silver-plated Substrate

作　　者：乜辉 高山 NIE Hui;GAO Shan(Chongqing Silian Optoelectronic Technogy Co.,Ltd.,Beibei 400707,China)

机构地区：[1]重庆四联光电科技有限公司,重庆北碚400707

出　　处：《中国照明电器》2021年第1期27-30,共4页China Light & Lighting

摘　　要：为了提高LED封装光源的抗硫化和发光性能,基于传统的镀银基板LED封装光源技术设计了一种底部涂覆的结构,实验探究其对LED封装器件的性能影响。结果表明:采用底部涂层技术制造镀银基板封装光源可有效提升产品的发光性能,同时产品的抗硫化能力和可靠性有一定的加强,对实际生产有一定的应用价值。In order to improve the anti-sulfur and luminous performance of LED package, a bottom coating structure was designed based on the traditional silver-plated LED package technology, and its effect on the performance of LED package devices was investigated by experiment. The results show that using the coating technology to product the LED package on silver-plated substrate can effectively improve the luminous performance and the anti-sulfur ability and reliability of the product can be improved, which has certain application value to the actual production.

关 键 词：LED封装 镀银基板 底部涂层 光强 抗硫化 

分 类 号：TN312.8[电子电信—物理电子学]