电沉积通孔铜箔数值模拟与实验研究  

Numerical simulation and experimental study on electrodeposition of copper foil with through holes

作　　者：费翔昱 宫本奎[1] 董志超[1,2] 冯锐 孙玉梅[1] 聂继伟 FEI Xiangyu;GONG Benkui;DONG Zhichao;FENG Rui;SUN Yumei;NIE Jiwei(School of Material Science and Engineering,Shandong University of Technology,Zibo 255049,China;Institute of Advanced Structure Technology,Beijing Institute of Technology,Beijing 10081,China)

机构地区：[1]山东理工大学材料科学与工程学院,山东淄博255049 [2]北京理工大学先进结构技术研究院,北京100081

出　　处：《电镀与涂饰》2021年第5期343-351,共9页Electroplating & Finishing

基　　金：山东省重点研发计划重大科技创新工程(2019TSLH0101)。

摘　　要：采用有限元方法通过Comsol Multiphysics软件模拟了电沉积通孔铜箔的过程。研究了镀液流速和电流密度对电沉积过程中铜离子浓度分布的影响,以及电流密度和极间距对通孔铜箔厚度分布均匀性的影响。模拟结果表明,镀液循环使铜离子分布均匀,利于铜箔沉积;通孔环形阵列分布和增大极间距可提高通孔铜箔的厚度分布均匀性。该模型的模拟结果与电沉积实验结果基本吻合。The electrodeposition of copper foil with thorough holes was simulated using Comsol Multiphysics software.The effects of flow rate of electrolyte and current density on the distribution of copper ions,as well as the effects of current density and interelectrode spacing on the thickness uniformity of copper foil were studied.The simulation results showed that the circulation of electrolyte makes copper ions distribute well,which is beneficial to the electrodeposition of copper foil.The thickness uniformity of copper foil could be improved by distributing pores in an annular array or increasing the interelectrode spacing.The simulation results of the model were in a good agreement with the experimental results.

关 键 词：通孔铜箔 电沉积 数值模拟 实验验证 浓度分布 厚度均匀性 

分 类 号：TQ153.14[化学工程—电化学工业]