高压力微孔填充工艺技术研究  

Research on High Pressure Micro-hole Filling Process Technology

作　　者：王慧[1] WANG Hui(The 45th Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2021年第2期29-32,共4页Equipment for Electronic Products Manufacturing

摘　　要：阐述了LTCC/HTCC器件制造领域内微孔填充工艺的发展现状和生产设备的发展趋势,介绍了高压力填孔设备的核心部件,并对该部件的机械结构、电气控制原理进行了详细分析;该部件可实现最大1000 N填孔压力输出,能满足高黏度金属浆料的填孔工艺需求;同时针对设备实际应用,引入正交试验设计方法,协助工艺人员快速掌握设备操作工艺。The paper introduces the technology situation of high pressure micro-hole filling process and the developments of production equipment.With the application of high viscosity metal pastes on micro-hole filling process,the production equipment needs to increase filling pressure output.A critical structure which filling pressure can be reach 1000 N has been applied to production equipment,also its mechanical structure and electrical circuit are mentioned in detail.In order to help process engineer master the operation skills of production equipment quickly,an experimental method is introduced,which called orthogonal design.

关 键 词：微孔填充 高压力 正交试验 

分 类 号：TN305.94[电子电信—物理电子学]