晶圆级微波测试工艺研究  

Process Research of Microwave Test in Wafer Level

作　　者：吕磊[1] 胡晓霞[1] 郑如意 LV Lei;HU Xiaoxia;ZHENG Ruyi(The 45th Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2021年第2期46-51,共6页Equipment for Electronic Products Manufacturing

摘　　要：从微波信号特性和微波器件晶圆级测试工艺要求出发,介绍了微波探针台的主要结构设计,并以某器件测试工艺为例,分别进行测试系统搭建、程序编写、数据读取与分析等描述,同时对该设备的特殊需求及后续发展方向进行展望。According to the characteristics of microwave signal and the wafer test process requirements of microwave devices,the main structure design of microwave probe is introduced.Taking a device test as an example,the test system construction,programming,data reading and analysis are described respectively.The special requirements and future development direction of the device are prospected in the meanwhile.

关 键 词：微波探针台 晶圆级测试 电磁屏蔽 

分 类 号：TN307[电子电信—物理电子学]