含硅芳炔树脂改性氰酸酯树脂的性能  

Properties of Cyanate Ester Modified by Silicone-Containing Arylacetylene Resin

作　　者：叶清 袁荞龙[1] 黄发荣[1] YE Qing;YUAN Qiaolong;HUANG Farong(Key Laboratory of Specially Functional Polymeric Materials and Related Technology of Ministry of Education,East China University of Science and Technology,Shanghai 200237)

机构地区：[1]华东理工大学特种功能高分子材料及相关技术教育部重点实验室,上海200237

出　　处：《宇航材料工艺》2021年第2期56-61,共6页Aerospace Materials & Technology

摘　　要：将双酚E型氰酸酯(BEDCy)与含硅芳炔树脂(PSA)用溶液共混的方法制备了共混树脂(BEDCy/PSA);通过DSC和原位红外研究了共混树脂的固化反应,使用TGA和DMA表征了树脂的耐热性能;还考察了共混树脂的介电性能和力学性能。结果表明,PSA树脂能够降低BEDCy树脂的固化温度;随着PSA树脂的添加,氮气和空气氛围下共混树脂固化物的Td5高于450℃,800℃的残留率分别在80%和19%以上;PSA树脂可以降低BEDCy树脂的介电常数和介电损耗。Bisphenol E cyanate ester(BEDCy)was blended with silicone-containing arylacetylene resin(PSA)to prepare a blended resin(BEDCy/PSA)via solution mixing and evaporation process.The curing reaction of the BEDCy/PSA was studied by DSC and in situ infrared monitoring,the heat resistance of the cured blended resins was characterized by TGA and DMA.The dielectric and mechanical properties of the cured blended resins were further evaluated.The results show that PSA can catalyze the curing reaction of BEDCy.With the addition of PSA resin,the temperature of 5%weight loss and residual yield at 800℃of the cured blended resins under nitrogen and air atmospheres are higher than 450℃,80%and 19%,respectively.The dielectric constant and dielectric loss of the cured BEDCy resin decreases upon addition of PSA resin.

关 键 词：含硅芳炔树脂 双酚E型氰酸酯 共混 介电性能 

分 类 号：TB35[一般工业技术—材料科学与工程]