射频烹饪器具关键组件散热技术研究  

Research on the cooling technology of key components of radio frequency cooking appliances

作　　者：陈宗龙 蒋学松 陈礼康 邓洋 CHEN Zonglong;JIANG Xuesong;CHEN Likang;DENG Yang(Guangdong Midea Kitchen Appliances Manufacturing Co.,Ltd.,Foshan 528311)

机构地区：[1]广东美的厨房电器制作有限公司,广东佛山528311

出　　处：《家电科技》2021年第2期68-71,共4页Journal of Appliance Science & Technology

摘　　要：随着加热技术的不断发展,传统的烹饪器具已不能满足高品质烹饪需求;新型的射频烹饪器具采用固态源作为能量发生装置,而固态源在工作过程中,其射频电路放大部分特别是功率芯片位置会产生大量的热耗,如果这些热量不能及时散去,会影响功率芯片的效率和可靠性,也会导致固态源的各项性能指标下降;因此提出了一种双层引流高效散热措施,通过采用非均衡比上下高效同步散热技术、固态源局部嵌铜技术及大风量低噪声流线型风道设计,使功率芯片衬底温度下降了41℃,实现了射频加热系统更紧凑、更高效的散热设计。With the development of heating technology, traditional cooking appliances can’t obtain high-quality cooking needs;Solid-state sources are used as energy generating devices in new-type RF cooking appliances. Especially the power chip will generate a lot of heat loss in the RF circuit during the operation of solid-state sources, if these heat losses can’t be dissipated in time, it will affect the efficiency and reliability of the chip, and reduce the performance indicators of the solid-state source. This paper proposes a high-efficiency double-layer drainage heat dissipation solution, which adopts an unbalanced ratio upper and lower high-efficiency synchronous heat dissipation technology, local copper embedding, and a highvolume, low-noise streamlined air duct design, which reduces the temperature of the power chip substrate by 41℃, it aims to achieve a more efficient heat dissipation design.

关 键 词：射频烹饪器具 射频加热系统 固态源 局部嵌铜 双层引流散热 

分 类 号：TM925.54[电气工程—电力电子与电力传动]