纸基芯片温控系统仿真与分析  

Simulation of a Thermal Control System for Paper-based Microfluidics

作　　者：熊凌鹄 孙浩 东辉 XIONG Ling-hu;SUN Hao;DONG Hui(School of Mechanical Engineering and Automation,Fuzhou University,Fuzhou,Fujian 350108;Fujian Provincial Collaborative Innovation Center of Equipment Manufacturing,Fuzhou,Fujian 350001;Institute of Intelligent Manufacturing,Fuzhou University,Fuzhou,Fujian 350108)

机构地区：[1]福州大学机械工程及自动化学院,福建福州350108 [2]福建省高端装备制造协同创新中心,福建福州350001 [3]福州大学智能制造仿真研究院,福建福州350108

出　　处：《液压与气动》2021年第5期68-73,共6页Chinese Hydraulics & Pneumatics

基　　金：国家自然科学基金(61604042,51605092);福建省自然科学基金(2017J01501);福建省高校杰出青年科研人才计划(601931);福耀玻璃仿真研究院项目(01001701)。

摘　　要：纸基微流控芯片(μPADs)为聚合酶链式反应、环介导等温扩增提供了新型平台,可用于新冠肺炎病毒检测等领域。为了达到纸基反应芯片所需要的正常工作温度,采用半导体制冷器(TEC)提供反应所需热源,应用有限元仿真软件(FEM)对TEC的整体结构进行建模,依据珀尔帖效应分别对元件中的N型和P型半导体定义并进行热电耦合,同时,研究不同外部环境下的加热效果。针对不同的物理条件下的纸基反应单元加热效果,可预测芯片最佳衬底材料。研究将有助于新型纸基微流控芯片和生化分析集成系统研制。Paper-based microfluidic devices(μPADs)provide novel platform for PCR and LAMP,which are able to detect COVID-19.For reaching the temperature required for reaction in paper chips,a thermos-electric cooler(TEC)is used.First,finite element method(FEM)is employed to build the model of TEC.According to the Peltier effect,the N-type and P-type semiconductors in the components are defined and thermoelectric coupled.Meanwhile,heat transfer efficiency of TEC under different external conditions are studied.Finally,based on the simulation,the most suitable material for constructing paper chip substrate can be predicted.Therefore,the work is useful for developing new μPADs and integrated systems for biochemical assays.

关 键 词：纸基微流控芯片 半导体制冷器 有限元仿真 珀尔帖效应 

分 类 号：TH137[机械工程—机械制造及自动化]