废旧手机线路板上芯片无损拆解过程研究  

Research on Nondestructive Disassembly Process of Chips on Printed Circuit Boards of Waste Mobile Phones

作　　者：段琪昱 张承龙 王瑞雪 马恩 黄庆 王景伟 符永高 邓梅玲 DUAN Qi-yu;ZHAGN Cheng-long;WANG Rui-xue;MA En;HUANG Qing;WANG Jing-wei;FU Yong-gao;DENG Mei-ling(WEEE Research Centre of Shanghai Polytechnic University,Shanghai 201209,China;Shanghai Collaborative Innovation Centrefor WEEE Recycling,Shanghai 201209,China;China National Electric Apparatus Research Institute,Guangzhou 510663,China)

机构地区：[1]上海第二工业大学电子废弃物研究中心,上海201209 [2]上海电子废弃物资源化协同创新中心,上海201209 [3]中国电器科学研究院股份有限公司,广州510663

出　　处：《有色金属（冶炼部分）》2021年第5期112-120,共9页Nonferrous Metals（Extractive Metallurgy)

基　　金：国家重点研发计划项目(2018YFC1902303);上海市高原学科-环境科学与工程(资源循环科学与工程)资助项目;上海第二工业大学研究生项目(EGD19YJ0057);上海第二工业大学校重点学科建设项目(XXKZD1602)。

摘　　要：为了更高效地回收手机芯片,对手机线路板拆解过程进行优化试验。拆解线路板选择空气热对流和热传导两种加热方式。通过试验分析了升温速率、保温时间和预热阶段温度对拆解过程和拆解芯片完整性的影响,确定3℃/s的升温速率、预热170℃保温90s的拆解效果更好。不同封装方式的芯片在拆解时的温度条件也有细微差异。In order to recycle mobile phone chips more efficiently,optimization experiments were carried out on disassembly process of mobile phone printed circuit boards.Two heating methods of air heat convection and heat conduction were chosen to disassemble printed circuit board.Effects of heating rate,holding time and preheating temperature on disassembly process and integrity of disassembled chip were analyzed through experiments.It is determined that heating rate of 3℃/s and preheating at 170℃for 90 s have better dismantling effects.There are also slight differences in temperature conditions when disassembling chips with different packaging methods.

关 键 词：线路板 无损拆解 芯片 

分 类 号：X76[环境科学与工程—环境工程]