脉冲电沉积制备低锡铜−锌−锡三元仿金合金  

Pulsed electrodeposition of gold-imitating low-tin ternary copper-zinc-tin alloy

作　　者：陈冲艳 丁莉峰 李强 袁进霞 张少奇 王昆 董红梅 牛宇岚 CHEN Chongyan;DING Lifeng;LI Qiang;YUAN Jinxia;ZHANG Shaoqi;WANG Kun;DONG Hongmei;NIU Yulan(School of Chemical Engineering and Technology,North University of China,Taiyuan 030051,China;Department of Chemistry and Chemical Engineering,Taiyuan Institute of Technology,Taiyuan 030008,China;College of Information and Computer,Taiyuan University of Technology,Taiyuan 030024,China)

机构地区：[1]中北大学化学工程与技术学院,山西太原030051 [2]太原工业学院化学与化工系,山西太原030008 [3]太原理工大学信息与计算机学院,山西太原030024

出　　处：《电镀与涂饰》2021年第7期507-515,共9页Electroplating & Finishing

基　　金：国家自然科学基金青年基金(NSFC51604180);山西省重点研发计划(社发领域)一般项目(201903D321068);山西省高等学校优秀成果培育项目(CSREP 2019KJ038);山西省高校科技创新计划(2019L0235);山西省应用基础研究计划项目面上青年基金项目(201701D221036)。

摘　　要：在304不锈钢表面脉冲电镀低锡Cu-Zn-Sn仿金合金,镀液组成为:CuSO_(4)·5H_(2)O 0.18 mol/L,ZnSO_(4)·7H_(2)O 0.06 mol/L,Na_(2)SnO_(3)·3H_(2)O 0.05 mol/L,Na_(3)C_6)H_(5)O_(7)·2H_(2)O 22.66 g/L,Na_(2)CO_(3)25 g/L,羟基乙叉二膦酸(HEDP)100 mL/L。研究了电镀时间、脉冲频率、脉冲占空比和平均电流密度对Cu-Zn-Sn合金镀层色泽、表面形貌和组成的影响,得到脉冲电镀的最佳工艺条件为:电镀时间66 s,脉冲频率4 kHz,占空比40%,平均电流密度3.5 A/dm^(2)。在最优条件下所得合金镀层呈金黄色,Cu、Zn、Sn的质量分数分别为88.03%、11.69%和0.28%,表面形貌和元素比例均优于直流镀层,但二者的相结构相同。Pulse electroplating of gold-imitating ternary copper-zinc-tin alloy with low tin content was conducted on 304 stainless steel in a bath comprising CuSO_(4)·5H_(2)O 0.18 mol/L,ZnSO_(4)·7H_(2)O 0.06 mol/L,Na_(2)SnO_(3)·3H_(2)O 0.05 mol/L,Na_(2)CO_(3)25 g/L,Na_(3)C_6)H_(5)O_(7)·2H_(2)O 22.66 g/L,and 1-hydroxyethylidene-1,1-diphosphonic acid(HEDP)100 mL/L.The effects of electroplating time,pulse frequency,duty cycle,and average current density on the appearance,surface morphology,and composition of Cu-Zn-Sn alloy coating were studied.The process parameters were optimized as follows:electroplating time 66 s,pulse frequency 4 kHz,duty cycle 40%,and average current density 3.5 A/dm^(2).The alloy coating obtained under the optimal conditions was golden yellow with Cu 88.03wt.%,Zn 11.69wt.%,and Sn 0.28wt.%,and had better surface morphology and elemental composition than that electroplated galvanostatically,while both had the same phase structures.

关 键 词：脉冲电镀 铜−锌−锡合金 仿金 低锡含量 占空比 脉冲频率 电流密度 

分 类 号：TQ153.2[化学工程—电化学工业]