屏蔽导线端头处理的一种新工艺  

A new technology for processing shielded wire ends

作　　者：马琳 曹宏伟 魏志强 Ma Lin;Cao Hongwei;Wei Zhiqiang(Tongfang Electronic Science and Technology Co.,Ltd,Jiujiang Jiangxi,332000)

机构地区：[1]同方电子科技有限公司,江西九江332000

出　　处：《电子测试》2021年第8期133-134,136,共3页Electronic Test

摘　　要：随着时代的进步发展,屏蔽导线端头处理工艺得以快速进步,常见的工艺包括绑扎与锡焊法两种模式,为了能够研究屏蔽导线端头处理新工艺,文章围绕低压注塑方式进行了详细的分析。通过实际调查发现,该种方式不仅呈现出了比较稳定的尺寸特点,而且也不需要耗用大量的时间,能够帮助企业节约资金投入的同时,发挥出巨大的应用价值。With the development of the times,the processing technology of shielded wire ends has made rapid progress.Common processes include two modes of binding and soldering.In order to be able to study the new processing of shielded wire ends,the article focuses on low-pressure injection molding.detailed analysis.Through actual investigation,it is found that this method not only presents relatively stable size characteristics,but also does not need to consume a lot of time.It can help enterprises save capital investment while exerting huge application value.

关 键 词：端头处理 绑扎法 锡焊法 低压注塑 

分 类 号：TM21[一般工业技术—材料科学与工程]