表贴式电阻器硫化腐蚀电化学机理及失效分析  

Mechanism of Conductive Layer Suffer from Sulfide Corrosion and Failure Analysis of Thick Film Chip Resistors

作　　者：畅玢 陈传庆 罗向阳 查远华 苟廷刚 王丹琴 CHANG Bin;CHEN Chuan-qing;LUO Xiang-yang;ZHA Yuan-hua;GOU Ting-gang;WANG Dan-qin(China Zhenhua Electronics Group Yuncko Electronics Co.,Ltd.,Guiyang 550018)

机构地区：[1]中国振华集团云科电子有限公司,贵阳550018

出　　处：《环境技术》2021年第2期18-21,共4页Environmental Technology

摘　　要：根据电化学理论分析片式膜固定电阻器导电层金属银层的腐蚀反应过程及电极电位对膜层腐蚀的机理及影响情况。并结合电阻器实际失效案例,对一只出现阻值增大的电阻器样品通过扫描电子显微镜(SEM)观察微观形貌,查找异常物质并通过能谱对异常点进行成分检测,确定其为硫化银,进一步了解了电阻器硫化失效的表现形式及产生特点。Based on the theory of electrochemistry,we had analyzed the corrosion mechanism of metallic silver layer which was the chip film fixed resistor and the effect of electrode potential.In addition,one of resistors with an increased resistance value was acquired to as an practical failure case of resistor.The resistor was scanned with scanning electron microscope(SEM)to observe the microscopic morphology.Through the SEM,we found out some abnormal chemical compound.Finally we made sure the chemical compound was silver sulfide by the energy spectrum analysis.

关 键 词：片式膜固定电阻器 导电层 硫化腐蚀 

分 类 号：TM207[一般工业技术—材料科学与工程]