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作 者:Hu Luo Khan Muhammad Ajmal Wang Liu Kazuya Yamamura Hui Deng
出 处:《International Journal of Extreme Manufacturing》2021年第2期45-87,共43页极端制造(英文)
基 金:financial support for this work from the Guangdong Basic and Applied Basic Research Foundation (2019A1515111133);the National Natural Science Foundation of China (Grant Nos. 52035009, 52005243);the research fund for International Cooperation (GJHZ20180928155412525) from the Science and Technology Innovation Committee of Shenzhen Municipality, Shenzhen, China。
摘 要:Diamond is a promising material for the modern industry. It is widely used in different applications, such as cutting tools, optical windows, heat dissipation, and semiconductors.However, these application areas require exceptionally flattened and polished diamond surfaces.Unfortunately, due to the extreme hardness and chemical inertness of diamond, the polishing of diamond is challenging. Since the 1920s, various conventional and modern mechanical,chemical, and thermal polishing techniques have been proposed and developed for finishing diamond surfaces. Therefore, to impart proper guidance on selecting a good polishing technique for production practice, this paper presents an in-depth and informative literature survey of the current research and engineering developments regarding diamond polishing. At first, a brief review of the general developments and basic material removal principles is discussed. This review concludes with a detailed analysis of each techniques' polishing performance and critical challenges, and a discussion of the new insights and future applications of diamond polishing.
关 键 词:diamond polishing material removal anisotropy ultra-smooth surface chemical reaction surface quality
分 类 号:TQ163[化学工程—高温制品工业]
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