锆表面双辉等离子渗铜工艺研究  

Copperizing technology on zirconium by double glow plasma surface alloying

作　　者：王建青[1] 景勤[1] WANG Jianqing;JING Qin(State Key Laboratory of Metastable Materials Science and Technology,Yanshan University,Qinhuangdao,Hebei 066004,China)

机构地区：[1]燕山大学亚稳材料制备技术与科学国家重点实验室,河北秦皇岛066004

出　　处：《燕山大学学报》2021年第3期215-219,226,共6页Journal of Yanshan University

基　　金：河北省重点研发计划项目(17211024);燕山大学博士基金项目(BL18050)。

摘　　要：对锆表面进行双辉等离子渗铜处理,得到连续的无明显缺陷的渗铜层。设计L9(34)正交实验,依据不同实验条件下的渗铜层厚度,分析得出主要实验因素对渗镀结果影响程度排序为:极间距>时间>温度>气压。综合考虑渗镀过程实际情况及实验对比,给出了锆表面双辉等离子渗铜的较优工艺参数。The continuous copperized layers without obvious defects were obtained on the surface of zirconium by double glow plasma surface alloying.L9(34)orthogonal experiment was designed and the thickness of copperized layers under different experimental conditions were obtained.According to the result,the influence degree of the main experimental factors on the thickness of copperized layer was analyzed,and the order was:ectrode distance>time>temperature>pressure.Considering the actual situation of the surface alloying process and the comparison of the experiments,the optimized technological parameters of copperizing on zirconium was given.

关 键 词：锆 双辉等离子表面渗镀 渗铜 正交实验 

分 类 号：TG146.4[一般工业技术—材料科学与工程]