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作 者:刘文婧 郑贵志 王海岭 王建国 LIU Wen-jing;ZHENG Gui-zhi;WANG Hai-ling;WANG Jian-guo(Inner Mongolia Autonomous Region Key Laboratory of Intelligent Diagnosis and Control of Electromechanical Systems,School of Mechanical Engineering,Inner Mongolia University of Science&Technology(chn),Inner Mongolia Baotou 014010,China;Mining Research Institute,Inner Mongolia University of Science&Technology(chn),Inner Mongolia Baotou 014010,China;Institute of Metrology and Physics,Inner Mongolia North Heavy Industry Group Co.,Ltd.,Inner Mongolia Baotou 014010,China)
机构地区:[1]内蒙古科技大学机械工程学院,内蒙古自治区机电系统智能诊断与控制重点实验室,内蒙古包头014010 [2]内蒙古科技大学矿业研究院,内蒙古包头014010 [3]内蒙古北方重工业集团有限公司,计量理化研究院,内蒙古包头014010
出 处:《机械设计与制造》2021年第5期212-216,共5页Machinery Design & Manufacture
基 金:内蒙古自治区自然科学基金(2018MS05007);内蒙古自然科学基金(2019MS05041)。
摘 要:由于特殊焊缝的内部结构复杂型,面临检测图谱成像质量差,缺陷识别定位困难等问题,选择最优的检测工艺参数对提高缺陷图谱成像质量成为研究重点。为了提高成像分辨率方便检测人员对缺陷图谱分析,基于CIVA仿真软件将试块进行三维建模,验证模型的适用型,并以晶片数量、探头频率、焦距作为独立变量,波峰波谷幅值差为响应量对试块进行仿真,运用响应面法对晶片数量、聚焦深度、探头频率工艺参数进行优化研究,并构建实验平台进行实验对比。结果表明:当横向分辨率最大即波峰波谷幅值差达到最大时,最终确定优化后的晶片数量为44、探头频率15MHz、焦距为40mm。Due to the complexity of the internal structure of special welds,facing the problems of poor imaging quality of inspection maps and difficulties in identifying and locating defects,selecting the optimal inspection process parameters has become a research focus for improving the imaging quality of defect maps.In order to improve the imaging resolution and facilitate the inspection personnel to analyze the defect map,the test block is three-dimensionally modeled based on the CIVA simulation software to verify the applicability of the model,and the number of wafers,probe frequency,and focal length are used as independent variables,and the peak and valley amplitude difference is the response volume is used to simulate the test block,and the response surface method is used to optimize the research on the number of wafers,the depth of focus,and the process parameters of the probe frequency,and an experimental platform is built for experimental comparison.The results show that when the lateral resolution is maximum,that is,the peak-to-valley amplitude difference reaches the maximum,the number of optimized wafers is 44,the probe frequency is 15MHz,and the focal length is 40mm.
分 类 号:TH16[机械工程—机械制造及自动化] TG115.28[金属学及工艺—物理冶金]
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