印制电路板制造中大腔体等离子体机的蚀刻均匀性研究  

Etching uniformity investigation of large chamber plasma machine for PCB

作　　者：吴振龙 付艺 孙威 彭建国 Wu Zhenlong;Fu Yi;Sun Wei;Peng Jianguo

机构地区：[1]珠海方正科技多层电路板有限公司-F7交付中心,广东珠海519175

出　　处：《印制电路信息》2021年第5期29-33,共5页Printed Circuit Information

摘　　要：随着5G产品的逐步推广,国内主流通信设备制造商的PCB尺寸也达到了单板651.5 mm以上。因此,为提高生产效率,大腔体的等离子机开始逐步应用于PCB钻孔后的除胶渣流程。但是等离子除胶渣需要满足一定的树脂蚀刻均匀性要求,大腔体的设计对蚀刻均匀性是一个挑战。文章主要从树脂蚀刻均匀性测试方法、计算方法和等离子机工艺气体进气孔排布等角度研究了5G大腔体等离子机蚀刻均匀性的影响因素,并对树脂蚀刻均匀性测试方法和计算方法进行了定义。With the gradual popularization of 5G products and meantime the PCB unit size of the main local communication equipment manufacturers is up to more than 27 in.Therefore,the large chamber Plasma machine is starting to be applied in Desmear process after PCB drilling for capacity improvement.However,Plasma Desmear need to satisfy some fixed resin etching uniformity.The large chamber design is a challenge to the etching uniformity.This paper investigated the etching uniformity method,calculation method and Plasma air hole arrangement effect on 5G large chamber plasma etching uniformity,and defined the etching uniformity test method and calculation method.

关 键 词：高频高速印制电路板 除胶均匀性 气孔排布 等离子体 

分 类 号：TN41[电子电信—微电子学与固体电子学]