高导热金刚石/铝复合材料的真空热压制备  

Preparation of high thermal conductivity diamond/aluminum composites by vacuum hot pressing

作　　者：徐洋[1] 沈维霞 范静哲 侯领 张壮飞 黄国峰 黎克楠 XU Yang;SHEN Weixia;FAN Jingzhe;HOU Ling;ZHANG Zhuangfei;HUANG Guofeng;LI Kenan(Department of Physical Science and Technology, Baotou Teachers College, Baotou 014030, Inner Mongolia, China;Key Laboratory of Material Physics of Ministry of Education, School of Physics and Microelectronics, Zhengzhou University, Zhengzhou 450052, China;Inor Mongolia Key Lab of High-pressure Phase Functional Materials, Chifeng University, Chifeng 024000, Inner Mongolia, China;State Key Laboratory of Superabrasives, Zhengzhou Research Institute for Abrasives & Grinding Co . , Ltd . , Zhengzhou 450001, China)

机构地区：[1]包头师范学院物理科学与技术学院,内蒙古包头014030 [2]郑州大学物理学院(微电子学院),材料物理教育部重点实验室,郑州450052 [3]赤峰学院,内蒙古自治区高压相功能材料重点实验室,内蒙古赤峰024000 [4]郑州磨料磨具磨削研究所有限公司,超硬材料磨具国家重点实验室,郑州450001

出　　处：《金刚石与磨料磨具工程》2021年第2期46-52,共7页Diamond & Abrasives Engineering

基　　金：国家自然科学基金资助项目(11704340,11804305);河南省科技攻关项目(202102210198);内蒙古自治区高压相功能材料重点实验室(cfxygy202002)。

摘　　要：以纯铝粉末和金刚石为基体材料,采用真空热压固相烧结方式制备出热导率为677 W/(m·K)的高导热金刚石/铝复合材料。利用激光导热仪、热膨胀仪对金刚石/铝复合材料性能进行表征,并通过对制备温度、保温时间及金刚石基本颗粒尺寸的调控来优化制备工艺。研究发现:随制备温度升高,金刚石/铝复合材料的密度及致密度均有所提高,其热导率呈先升后降的趋势,当制备温度为650℃时,热导率达到526.2 W/(m·K)。随着保温时间由30 min增加至120 min,金刚石/铝复合材料的密度、致密度和热导率均增大,致密度达到99.1%,热导率达到566.7 W/(m·K)。当金刚石基本颗粒尺寸由20μm增加至500μm时,金刚石/铝复合材料的密度、致密度先增大后减小;在金刚石基本颗粒尺寸为200μm时,密度达到最大,分别为3.06 g/cm3和98.4%;热导率随金刚石基本颗粒尺寸逐渐增大,在金刚石基本颗粒尺寸为500μm时,热导率达到677.5 W/(m·K),为目前最高增强效率。故通过工艺控制可以有效提高铝基体与金刚石的结合,减少其界面空隙,进而制备出高热导率金刚石/铝复合材料。A high heat-conducting diamond/aluminum composite material with thermal conductivity of 677 W/(m·K)was prepared by vacuum hot-pressing solid-phase sintering.The properties of the diamond/aluminum composite were characterized by laser thermal conductivity instrument and thermal expansion instrument.The preparation process was optimized by modifying the preparation temperature,holding time and diamond particle size.It was noted that the density and relative density of diamond/aluminum composite increased with the increase of the preparation temperature,and the thermal conductivity first rose and then fell.When the preparation temperature was 650℃,the thermal conductivity reached 526.2 W/(m·K).When the heat preservation time increased from 30 minutes to 120 minutes,the density,the relative density and the thermal conductivity of diamond/aluminum composite materials all increased to the density of 99.1%and the thermal conductivity of 566.7 W/(m·K).When the size of diamond particle increased from 20μm to 500μm,the density and relative density of diamond/aluminum composite first increased and then decreased.When the size of diamond particle is 200μm,the density and relative density reached their maximum values,namely 3.06 g/cm3 and 98.4%.The thermal conductivity increased with the increase of diamond size,and the thermal conductivity reached the highest 677.5 W/(m·K)when using 500μm diamond particles as thermal conductive fillers.Therefore,high-density diamond/aluminum composite material prepared by vacuum hot pressing method can effectively improve the combination of aluminum matrix and diamond through process control,reduce interfacial void,and then prepare high thermal conductivity diamond/aluminum composite material.

关 键 词：金刚石/铝复合材料 热导率 致密度 真空热压法 

分 类 号：O521.3[理学—高压高温物理]