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作 者:孙悦 申丽丽 李迎昕 段文鹏 SUN Yue;SHEN Lili;LI Yingxin;DUAN Wenpeng(Beijing No.3 Testing Center for Military Electronic Components,Beijing 100015)
机构地区:[1]军用电子元器件北京第三检测中心,北京100015
出 处:《计算机与数字工程》2021年第4期681-685,共5页Computer & Digital Engineering
摘 要:电感式接近开关的封装形式中,全金属封装是比较常见的一种类型。目前,市场上的电感式接近开关,包括具有内腔的外壳和设置在内腔中的开关组件,其开关组件多采用环氧树脂固定在内腔中。在这类接近开关的失效分析工作中,由于难以去除金属外壳及内部灌封树脂,常使失效分析工作难以开展。论文结合一款全金属封装的电感式接近开关的失效案例,在不破坏失效接近开关内部开关组件工作电路的前提下,介绍了一种全金属封装接近开关有效开封方式及失效分析方法。Among the packaging forms of inductive proximity switches,all-metal packaging is a relatively common type.At present,the inductive proximity switches on the market include a housing with an inner cavity and a switch assembly arranged in the inner cavity,and the switch assembly is mostly fixed in the inner cavity with epoxy resin.In the failure analysis work of this type of proximity switch,it is often difficult to carry out the failure analysis work because it is difficult to remove the metal shell and the in⁃ternal potting resin.Based on a failure case of an all-metal-encapsulated inductive proximity switch,this paper introduces an effec⁃tive opening method and failure analysis method for an all-metal-encapsulated proximity switch without destroying the working cir⁃cuit of the internal switch components of the failed proximity switch.
分 类 号:U48[交通运输工程—载运工具运用工程]
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