A flexible adhesive with a conductivity of 5240 S/cm  

一种柔性导电银胶的研发

作　　者：Dongwei Zhang Sai Liu Yue Jiang Yuxin Yin Zhengjie Xu Xiangyu Kong Guofu Zhou Jun-Ming Liu Krzysztof Kempa Liming Ding Jinwei Gao 张东伟;刘赛;姜月;尹钰鑫;徐政杰;孔祥宇;周国富;刘俊明;Krzysztof Kempa;丁黎明;高进伟(Guangdong Provincial Key Laboratory of Optical Information Materials and Technology,Academy of Advanced Optoelectronics,South China Normal University,Guangzhou 510006,China;Laboratory of Solid State Microstructures,Nanjing University,Nanjing 210093,China;Department of Physics,Boston College,Chestnut Hill MA 02467,USA;Center for Excellence in Nanoscience(CAS),Key Laboratory of Nanosystem and Hierarchical Fabrication(CAS),National Center for Nanoscience and Technology,Beijing WO 190,China;Guangdong Provincial Engineering Technology Research Center for Transparent Conductive Materials,Guangzhou 510006,China)

机构地区：[1]Guangdong Provincial Key Laboratory of Optical Information Materials and Technology,Academy of Advanced Optoelectronics,South China Normal University,Guangzhou 510006,China [2]Laboratory of Solid State Microstructures,Nanjing University,Nanjing 210093,China [3]Department of Physics,Boston College,Chestnut Hill MA 02467,USA [4]Center for Excellence in Nanoscience(CAS),Key Laboratory of Nanosystem and Hierarchical Fabrication(CAS),National Center for Nanoscience and Technology,Beijing WO 190,China [5]Guangdong Provincial Engineering Technology Research Center for Transparent Conductive Materials,Guangzhou 510006,China

出　　处：《Science Bulletin》2021年第7期657-660,M0003,共5页科学通报（英文版）

基　　金：financial support from the National Key Research and Development Program of China(2016YFA0201002);the National Natural Science Foundation of China(U1801256,51803064;51721001);the Science and Technology Program of Guangzhou(2019050001);support from the Key Lab of Functional Molecular Engineering of Guangdong Province(2018kf05);National Key Research and Development Program of China(2017YFA0206600);the National Natural Science Foundation of China(51773045,21772030,51922032;21961160720)for financial support。

摘　　要：Conductive adhesives(CAs)providing reliable connectionsbetween electronic components.have been widely used in solarcells[1],light emitting diodes(LED5)[2],radio frequency compo-nents[3],and printed&wearable circuits.etc.[4-6].Basically,CAs are mainly composed of conductive fillers and resin,whichgive the mechanical.adhesive function.and the conductive path,respectively[7].Among conductive fillers with high conductivity,such as carbon materials[7,8].and metals[4,5.9.10],are the keycomponent[9,10],determining the feature and cost of the CAs.导电银胶是柔性薄膜电子器件的重要基础材料,而高性能、低成本导电介质—低维银片及其制造技术是一项重要研究课题.本文发展了一种低成本、环保、且适合卷对卷制备的低维导电银片的制作方法.该方法制备的微纳银片,形貌尺寸可控(直径:20200μm;厚度20300 nm)、性能优异.进而,基于聚氨酯基底,制备了柔性、无助剂的导电银胶.该导电银胶渗流阈值远低于采用其他银颗粒填料所制备的银胶.当银片添加量仅为13.7 wt%时,导电银片能有效形成导电网络,其电导率高达5240 S/cm,显著优于同类导电银胶;而且,当拉伸比例为40%时,电导率未见明显变化.所制备超薄银片的大比表面积、光滑表面使其形成有效的错位堆积,构建有效电子通路,从而赋予导电银胶的高电导、高柔性.

关 键 词：导电银胶 柔性薄膜 光滑表面 渗流阈值 导电介质 电导率 导电网络 高电导 

分 类 号：TN04[电子电信—物理电子学]