高分子绝缘材料在功率模块封装中的研究与应用  

Study and Application of Polymer Insulating Material in Power Module Packaging

作　　者：曾亮 齐放 戴小平 ZENG Liang;QI Fang;DAI Xiaoping(Coresing Semiconductor Technology Co.,Ltd.,Zhuzhou 412001,China;Hunan Power Semiconductor Manufacturing Innovation Center,Zhuzhou 412001,China)

机构地区：[1]湖南国芯半导体科技有限公司,湖南株洲412001 [2]湖南省功率半导体创新中心,湖南株洲412001

出　　处：《绝缘材料》2021年第5期1-9,共9页Insulating Materials

基　　金：湖南省科技计划基金资助项目(2018XK2202)。

摘　　要：本文介绍了高分子绝缘材料在功率模块封装中的研究与应用情况,包括有机硅凝胶、环氧灌封胶、环氧模塑料、塑料框架等材料,并对其性能指标和国内外研究现状等进行了阐述。最后对高分子材料在功率模块封装中的应用方向进行了展望,即优化使用工艺,提高产品稳定性和绝缘性能,开发耐温度冲击、热膨胀系数低、介电强度高的材料以及研究新型应用技术等。This paper introduces the research and application of polymer insulating materials in power module packaging,including silicone gel,epoxy potting adhesive,epoxy molding compound,plastic frame and other materials,and their performance indicators and research status at home and abroad were elaborated.Finally,the application direction of polymer insulating materials in power module packaging was prospected,including optimizing the use process,improving the stability and insulation performance,developing materials with temperature shock resistance,low linear thermal expansion coefficient,and high dielectric strength and studying new applications technology.

关 键 词：绝缘材料 功率模块 有机硅树脂 环氧树脂 

分 类 号：TM215.1[一般工业技术—材料科学与工程]