基于变温红外的苯基苯酚改性酚醛树脂固化机理研究  

CURING MECHANISM OF PHENOLIC RESIN MODIFIED BY PHENYLPHENOL BASED ON VARIABLE TEMPERATURE FTIR SPECTRA

作　　者：张莹 胡宏林[1] 王在铎 刘亮[1] 余瑞莲[1] ZHANG Ying;HU Hong-lin;WANG Zai-duo;LIU Liang;YU Rui-lian(Science and Technology on Advanced Functional Composites Laboratory,Aerospace Research Institute of Materials&Processing Technology,Beijing 100076,China;The First Military Representative Office of Naval Equipment Department in Beijing,Beijing 100076,China)

机构地区：[1]航天材料及工艺研究所先进功能复合材料技术国防科技重点实验室,北京100076 [2]海装驻北京地区第一军事代表室,北京100076

出　　处：《复合材料科学与工程》2021年第5期37-42,79,共7页Composites Science and Engineering

基　　金：基础加强计划重点基础研究项目(2019-JCJQ-ZD-278-00)。

摘　　要：针对高碳酚醛树脂固化反应机理随温度的演变机制不清晰的问题,采用变温红外光谱研究了树脂特征官能团羟甲基、不同取代位亚甲基和醚键的变化规律,结合热重-质谱分析了固化过程释放气体的种类,研究了树脂从90℃~230℃发生的主要固化反应。结果表明:90℃~120℃,主要为酚环对-对位相连的亚甲基生成反应,此阶段较难生成邻-对位亚甲基桥连结构;120℃~170℃,主要为对-对位相连的亚甲基生成反应;170℃~200℃,主要为醚键断裂和羰基的生成反应,以及丙基桥连结构的生成反应;200℃以上,主要为酚羟基之间的脱水反应以及羰基的生成反应,醚键在230℃以上基本断裂完全。本文提供了一个新的研究树脂固化机理的思路,为合理设计高碳酚醛树脂复合材料固化工艺制度提供了有益的指导和帮助。To solve the problem that the curing mechanism of phenylphenol modified phenolic resin remained unclear, the characteristic structure hydroxymethyl, different substituent methylene, and ether bond were investigated by variable temperature FT-IR. The gas products released with the increase of curing temperature were characterized by Thermogravimetry-Mass Spectrometry. The curing mechanism from 90 ℃ to 230 ℃ was concluded finally. The results showed that the main reaction was the formation of the p-p methylene group in the range of 90 ℃~120 ℃. It is difficult to form the o-p methylene bridge at this stage. In the range of 120 ℃~170 ℃, the main reaction is the formation of the p-p methylene group. From 170 ℃ to 200 ℃, the main reactions are the breaking of the ether bond, the formation of the carbonyl group, and the formation of the propyl bridge. Above 200 ℃, the main reactions could be polycondensation reaction among phenolic hydroxyl groups, and the formation reaction of carbonyl groups. The ether bond breaks completely above 230 ℃. This work provides a new method to study the curing mechanism of phenolic resin. It is a benefit for the rational design of the curing process of phenolic resin.

关 键 词：酚醛树脂 固化机理 变温红外 热重-质谱 复合材料 

分 类 号：TB332[一般工业技术—材料科学与工程]