机构地区:[1]电磁防护材料及技术山西省重点实验室,太原030032 [2]中国电子科技集团公司第33研究所,太原030032
出 处:《材料导报》2021年第9期9133-9139,9149,共8页Materials Reports
基 金:国家自然科学基金(U1710115);山西省自然科学基金面上项目(201701D121050);山西省科学基金青年基金项目(201901D211576)。
摘 要:随着电子设备功率密度的提高,电子器件的电磁兼容和散热问题日趋严重,兼具双功能特性的导热吸波材料成为解决该问题的新趋势。目前,该类材料主要的研发思路是在高分子基体中同时加入导热填料和吸波剂以实现材料的导热吸波双功能。然而,橡胶等高分子材料中功能填料添加量存在最大限度,导热填料与吸波剂添加量存在此消彼长的问题,难以实现两种性能的协同提升。目前,尚无有效手段解决这一难题,只能通过协调两种功能填料的添加比例,确定材料导热和吸波性能的最优平衡点。鉴于影响材料导热性能和吸波性能的因素很多,且各因素之间相互影响,本领域学者通过研究填料组分之间的关系,综合分析了粒径、结构参数和成型工艺参数等因素对材料性能的影响,最终得到了对实际应用具有较高指导价值的组分调节机理和方法。经过十多年的发展,导热吸波材料的制备技术取得了长足进步,但仍存在一些技术瓶颈没有突破,制约着整个行业的发展。例如,缺乏材料微观结构和功能单元模型、通用设计理论不能指导实际工业生产、尚无兼具导热与吸波功能的单组分填料等问题都严重制约了导热吸波材料基础设计理论的发展。在导热吸波材料的工业化生产过程中,材料导热性能测试标准种类多,测试结果不具有对比性;而吸波性能目前存在两种评价方法,其在评价指标、测试原理、测试方法和测试标准等方面存在较大差异,检测结果无法横向比较。综上,目前导热吸波材料的性能评价缺少统一规范的标准,严重制约了产品的推广应用。同时,导热吸波材料的主要功能指标还需要进一步提升,以满足实际使用的需求。本文综述了导热吸波材料的研究历程和最新研究进展,分析了导热吸波材料研究中需要解决的问题,并展望了其未来的研究热点和技术发展方向,Microwave absorbing materials can effectively solve the electromagnetic compatibility of electronic equipment while thermal conductive mate-rials are the key to heat dissipation of electronic devices.As the power density of electronic devices has increased,significant time has been spent researching the functional integration of microwave absorbing materials and thermal conductive materials,in order to improve the electromagnetic compatibility and heat dissipation of electronic devices.Most studies improved the thermal conductivity and microwave absorbing performance of the materials by simultaneously adding a traditional thermal conductive filler and microwave absorbing agent into the matrix.However,due to the limit on the total amount of functional fillers in polymer materials,adding one of the functional fillers(thermal conduction or microwave absorption)will inevitably reduce the content of the other functional filler,which can hardly achieve the collaborative improvement of two properties.At present,there is no effective method to solve this problem;thermal conduction and microwave absorption performance can only be balanced by coordinating the two functional filler proportions.There are many factors influencing the thermal conductivity and microwave absorption performance of materials,with the different factors often interacting with one another.To reduce the complexity of the issue,the influence of various factors on material performance(such as particle size,structural parameters and process parameters)have been comprehensively analyzed,by studying the relations between the doping filler components.Finally the regulation mechanism and method can be obtained,which have a high guidance value for practical application.After more than ten years of development,researchers have made great progress in developing the preparation technology of thermal microwave absorbing materials.However,some technical bottlenecks still remain,hinding any further development of the industry.For example,the lack of a material micr
分 类 号:TN972[电子电信—信号与信息处理] TM25[电子电信—信息与通信工程]
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