核壳填料Ag@TiO_(2)对PTFE基复合材料微波介电性能的调控特性研究  

Modulation of microwave dielectric properties of PTFE based composite Materials by Ag@TiO_(2) core-shell fillers

作　　者：郑金桥[1] 梁飞[2] 戴金航 宋小军[1] 龚红伟[1] ZHENG Jinqiao;LIANG Fei;DAI Jinhang;SONG Xiaojun;GONG Hongwei(Department of University-Industry Cooperation,ZTE Corporation,Shenzhen 518057,Guangdong Province,China;School of Optics and Electronic,Huazhang University of Science and Technology,Wuhan 430074,China)

机构地区：[1]中兴通讯股份有限公司产学研合作司,广东深圳518057 [2]华中科技大学光学与电子信息学院,湖北武汉430074

出　　处：《电子元件与材料》2021年第5期460-467,共8页Electronic Components And Materials

基　　金：国家重点研发计划(2017YFB0406301);中兴通讯产学研合作基金(2018ZTE08-04)。

摘　　要：高介电常数聚合物基微波介质材料同时具有较高的介电常数与良好的机械性能,拥有广阔的应用前景。本研究通过溶胶凝胶法在纳米银分散液中将钛酸四丁酯水解,制备了不同Ag/TiO_(2)摩尔比的Ag@TiO_(2)核壳颗粒,并作为填料与聚四氟乙烯(PTFE)复合制备出Ag@TiO_(2)/PTFE复合材料。通过X射线衍射分析、扫描电镜形貌分析、EDS分析等测试手段对实验样品形貌、组分进行了分析。采用核壳结构制备的Ag@TiO_(2)颗粒与PTFE复合后,样品的介电常数与损耗随Ag@TiO_(2)填充比例升高而递增,在填充比例为60%体积分数下可以制备出介电性能与导热性能俱佳、与金属相容性良好的微波介电材料。测试结果表明,在该比例下样品同时具有高介电常数(25.22)、低介电损耗(5.2×10^(-3))、较高的热导率(1.367 W/(m·K))和较低的线膨胀系数(25.6×10^(-6)/℃),可以满足微波无源器件轻量化、小型化的应用需求。High dielectric constant and polymer-based microwave dielectric materials usually have good mechanical properties,making them have wide application prospects.In this study,Ag@TiO_(2)core-shell nanoparticles with different Ag/TiO_(2)molar ratios were prepared by the hydrolysis of tetrabutyl titanate by sol-gel method,which were used as fillers for polytetrafluoroethylene(PTFE)matrix.The morphology and composition of the samples were tested by X-ray diffraction,scanning electron microscopy and EDS analysis.The dielectric constant and loss of Ag@TiO_(2)/PTFE samples increases with the filling Ag@TiO_(2)core-shell particles.When the filling ratio of Ag@TiO_(2)is 60%,microwave dielectric materials with good dielectric and thermal properties was prepared,which also have good compatibility with metal.The test results show that the 60%Ag@TiO_(2)/PTFE high dielectric constant microwave dielectric composites have high dielectric constant(25.22),extremely low dielectric loss(5.2×10^(-3)),high thermal conductivity(1.367 W/(m·K))and low linear expansion coefficient(25.6×10^(-6)/℃).It can meet the needs of lightweight and miniaturized application of microwave passive devices.

关 键 词：PTFE基复合材料 Ag@TiO_(2) 微波介电性能 导热性能 核壳结构 

分 类 号：TB333[一般工业技术—材料科学与工程]