Trace bis-(3-sulfopropyl)-disulfide enhanced electrodeposited copper foils  

作　　者：Lingling Liu Yeqiang Bu Yue Sun Jianfeng Pan Jiabin Liu Jien Ma Lin Qiu Youtong Fang 

机构地区：[1]School of Materials Science and Engineering,Zhejiang University,Hangzhou,310027,China [2]Zhejiang Huayuan New Energy Co.,Ltd,Dongyang,322100,China [3]College of Electrical Engineering,Zhejiang University,Hangzhou,310027,China

出　　处：《Journal of Materials Science & Technology》2021年第15期237-245,共9页材料科学技术（英文版）

基　　金：the National Key R&D Program of China(No.2017YFB1200800);the National Natural Science Foundation of China(Nos.51827810 and 51637009);the Fundamental Research Funds for the Central Universities(2018XZZX001-05)。

摘　　要：Smooth and strong copper foils are highly required for the development of printed circuit boards and Li-ion batteries.Adding additives is an efficient and low-cost method to enhance electrodeposited copper foils.Here we chose Bis-(3-sulfopropyl)-disulfide(SPS)as the additive and investigated its concentration on the surface roughness and tensile strength of the electrodeposited copper foils.A copper foil with the smoothest surface(Rz=2.1μm)and the highest tensile strength(~338 MPa)was prepared with1.5 mg/L SPS.The contact angle on the copper foil decreased with the reduction of surface roughness.The enhancing mechanism of the SPS was investigated by scanning electron microscopy and X-ray diffraction.The refined grain and enhanced(220)texture were considered to be the radical reason for the smooth and strong copper foils.The electrochemical results prove the suppressing effect is related to the SPS adsorption.

关 键 词：Electrodeposited copper foil Bis-(3-sulfopropyl)-disulfide Surface roughness Tensile strength 

分 类 号：TQ153[化学工程—电化学工业] TM912[电气工程—电力电子与电力传动] TN41[电子电信—微电子学与固体电子学]