表面贴装元件粘胶加固工艺质量优化  

Optimization of Reinforced Component with Glue Process for Surface Mount Components

作　　者：廖希异 邓丽 高振奎 LIAO Xiyi;DENG Li;GAO Zhenkui(The 24th Research Institute of China Electronics Technology Group Corporation Chongqing 400060,P.R.China)

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2021年第2期240-245,共6页Microelectronics

基　　金：模拟集成电路国家重点实验室基金资助项目(6142802040805)。

摘　　要：介绍了一种提升表面贴装元件粘胶加固工艺质量的方法。归纳了表征表面贴装元件粘胶加固工艺质量的关键指标,通过正交试验优化了胶体固化工艺,大幅提升了片式元件粘胶加固的工艺质量一致性。观察了改进前后胶体分布情况,以及胶体流淌对周边元器件的影响,简要分析了胶体固化工艺对粘胶加固质量的影响机理。A method for improving the reinforcing quality of the surface mount components with glue was introduced. The key indexes to characterize the adhesive reinforcement process quality of surface mount elements were summarized. Based on the indexes, the orthogonal experiment was studied. According to the results, the reinforced component’s adhesive-force was improved and had high consistency. Moreover, some differences in the glue morphology and the influence of glue flowing on the nearby components were observed before and after improvement. The mechanism of reinforcing components with glue was discussed around the mainly factors.

关 键 词：元件粘胶加固 粘接剂固化工艺 正交试验 

分 类 号：TN305.94[电子电信—物理电子学]