烧结温度对Ti_(3)SiC_(2)/SiC陶瓷材料性能的影响  

Effect of Sintering Temperature on the Properties of Ti_(3)SiC_(2)/SiC Ceramics

作　　者：解玉鹏[1] 孙添鑫 徐俊 XIE Yupeng;SUN Tianxin;XU Jun(College of Science,Jilin Institute of Chemical Technology,Jilin 132022,China)

机构地区：[1]吉林化工学院理学院,吉林吉林132022

出　　处：《大学物理实验》2021年第2期10-12,共3页Physical Experiment of College

基　　金：吉林省教育厅科学研究资助项目(JJKH20190832KJ);吉林市科技创新发展计划项目(201831777);2020年吉林省大学生创新创业训练计划。

摘　　要：以微米级TiC粉和Si粉为主要原料,Al粉为烧结助剂,采用无压烧结工艺制备Ti_(3)SiC_(2)/SiC陶瓷材料,研究了烧结温度对陶瓷材料显微结构及力学性能的影响。结果表明,随着烧结温度的升高,Ti_(3)SiC_(2)/SiC陶瓷材料的弯曲强度先提高后降低。烧结温度为1500℃的陶瓷材料力学性能最佳,其密度为4.88 g/cm^(-3)。With micron-grade TiC powder and Si powder as the main raw materials,Al powder is the sintering aid,and Ti_(3)SiC_(2)/SiC ceramics are prepared by pressure-free sintering process,and the effect of sintering temperature on the microstructure and mechanical properties of ceramics is studied.The results show that with the increase of sintering temperature,the flexural strength of Ti_(3)SiC_(2)/SiC ceramics is increased and then decreased.Ceramics with sintering temperature of 1500 degrees have the best mechanical properties and density of 4.88 g/cm^(-3).

关 键 词：Ti_(3)SiC_(2) 陶瓷 弯曲强度 微观结构 

分 类 号：O469[理学—凝聚态物理]