基于逆向工程的闸门底枢磨损量测量  

Wear Measurement of Gate Bottom Pivot Based on Reverse Engineering

作　　者：龚壮辉 苏丹 胡远航 彭巍 洪俊鹏 袁泽坤 GONG Zhuanghui;SU Dan;HU Yuanhang;PENG Wei;HONG Junpeng;YUAN Zekun(College of Mechanical&Power Engineering,China Three Gorges University,Yichang 433002,China)

机构地区：[1]三峡大学机械与动力学院,湖北宜昌433002

出　　处：《机械工程师》2021年第6期52-55,共4页Mechanical Engineer

摘　　要：闸门底枢蘑菇头磨损量小且为曲面,传统的测量方法难以精确获得磨损量,文中提出采用基于逆向工程技术的蘑菇头磨损量测量方法。首先通过三维扫描仪获取磨损试验前后的蘑菇头点云数据,其次采用逆向工程软件算法将磨损前后的蘑菇头点云数据对齐,通过3D比较和体积计算,测算出磨损区域的最大磨损高度。结果表明,该方法能够较为准确地实现蘑菇头磨损量的测量,同时再现磨损区域的空间几何形状,实现磨损量测量过程的数字化、定量化和可视化。The wear amount of the mushroom head of the gate bottom pivot is small and curved.The traditional measurement method is difficult to accurately obtain the wear amount.This paper proposes a method for measuring the wear amount of the mushroom head based on reverse engineering technology.Firstly,the mushroom head point cloud data before and after the wear test is acquired through a three-dimensional scanner.Secondly,the reverse engineering software algorithm is used to align the mushroom head point cloud data before and after wear.Through 3D comparison and volume calculation,the maximum wear height of the wear area is measured.The results show that this method can more accurately measure the wear of mushroom heads,and at the same time reproduce the spatial geometry of the wear area,and realize the digitization,quantification and visualization of the wear measurement process.

关 键 词：逆向工程 蘑菇头 云数据 磨损量测量 

分 类 号：TH12[机械工程—机械设计及理论] TH16