席夫碱环氧树脂固化动力学特性研究  

Study on curing kinetics of Schiff base EP

作　　者：陈自兵 李玲[1] 王耀[1] 刘翔宇 Chen Zibing;Li Ling;Wang Yao;Liu Xiangyu(School of Materials Science and Engineering,North University of China,Taiyuan 030051)

机构地区：[1]中北大学材料科学与工程学院,太原030051

出　　处：《化工新型材料》2021年第4期184-189,共6页New Chemical Materials

摘　　要：采用动态差示扫描量热法(DSC),对4,4′-二氨基二苯砜(DDS)、4,4′-二氨基二苯甲烷(DDM)两种固化剂与席夫碱环氧树脂4,4′-二羟基二苯亚胺(DEI)组成的不同体系的固化反应过程进行了研究。根据不同升温速率下的DSC固化反应参数,用Kissinger、Ozawa和Flynn-Wall-Ozawa三种方法求得DEI与DDS、DDM固化反应的平均活化能分别为72.75kJ/mol、68.99kJ/mol。另外,利用固化反应温度与升温速率的关系,分别确定了DEI与DDS、DDM的固化温度和固化时间。The curing reaction of 4,4′-diaminodiphenylsulfone(DDS)and 4,4′-diaminodiphenylmethane(DDM)with Schiff base epoxy resin(EP)4,4′-dihydroxydiphenylimine(DEI)were studied by dynamic differential scanning calorimetry(DSC).According to the curing reaction parameters of DSC at different heating rates,the average activation energies of DEI with DDS and DDM were obtained as 72.75 kJ/mol and 68.99 kJ/mol respectively by Kissinger,Ozawa and Flynn-Wall-Ozawa methods.In addition,the curing temperature and curing time of DEI,DDS and DDM were determined by the relationship between curing reaction temperature and heating rate.

关 键 词：席夫碱环氧树脂 差示扫描量热法 固化动力学 活化能 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]