PMMA双面微流控芯片热压成型数值模拟  

Numerical Simulation of Hot Embossing of PMMA Double-Sided Microfluidic Chip

作　　者：左思璐 傅志红[1] 余文清 Zuo Silu;Fu Zhihong;Yu Wenqing(College of Mechanical and Electrical Engineering,Central South University,Changsha 410083,China)

机构地区：[1]中南大学机电工程学院,长沙410083

出　　处：《工程塑料应用》2021年第6期84-88,94,共6页Engineering Plastics Application

基　　金：长沙市科技计划项目(kh1902095)。

摘　　要：针对某公司设计的双面微流控芯片进行热压成型数值模拟,该微流控芯片集成了微流道、微孔阵列和微腔阵列,可以同时实现样品注射、液体迁移和核酸扩增等功能,实现单一样本的不同项目同时检测。利用有限元软件DEFORM-3D,考虑聚甲基丙烯酸甲酯(PMMA)材料的黏弹性行为,对双面微结构微流控芯片热压成型过程进行数值模拟,以微结构表征点的相对误差作为评价标准,建立简化的三维模型,研究了下压距离、热压压力、热压温度和热压时间对微结构复制情况的影响。数值模拟表明,可通过热压方式一次性成型具有通孔阵列和双面微结构的PMMA微流控芯片,当下压距离为1.4 mm、热压温度为130℃、热压压力4 kN、热压时间为60 s时,成型效果最好。Dumerical simulation of hot empress molding was carried out for a double-sided microfluidic chip designed by a company.The chip integrated with microfluidic channels,microwell arrays and microcavity arrays,which could realize the functions of sample injection,liquid migration,nucleic acid amplification and other functions,to achieve different items of a single sample simultaneously detected.Using the finite element software DEFORM-3D,a numerical simulation of the hot embossing process of the polymethylmethacrylate(PMMA)double-sided microstructure microfluidic chip was carried out.The viscoelastic material model of PMMA was established in the simulation and the relative error of the microstructure was characterized as the evaluation criteria.The effects of the processing parameters,such as,the influence of the pressing distance,hot pressing pressure,hot pressing temperature and hot pressing time on the microstructure replication were investigated.When the pressing distance is 1.4 mm,the hot pressing temperature is 130℃,the hot pressing pressure is 4 kN,and the hot pressing time is 60 s,the double-sided microstructure can be better formed.

关 键 词：双面微流控芯片 热压成型 数值模拟 聚甲基丙烯酸甲酯 

分 类 号：TD807[矿业工程—矿山开采]