谈导热材料多层厚铜板制作工艺  

Manufacturing process of multilayer thick copper board with thermal conductive material

作　　者：叶锦群 张永谋 张亚锋 Ye Jinqun;Zhang Yongmou;Zhang Yafeng

机构地区：[1]胜宏科技(惠州)股份有限公司,广东惠州516211

出　　处：《印制电路信息》2021年第6期28-30,共3页Printed Circuit Information

摘　　要：当前FR-4导热材料基本上都以填充陶瓷、三氧化二铝等复合材料,使之具有耐热、导热、散热的特点,其主要应用在大功率电源电子产品中,多为厚铜多层板设计。本文主要针对此类材料在生产加工过程中遇到的压合可靠性、钻孔毛刺、激光盲孔残胶等主要问题进行讨论。At present,the thermal conductive materials of FR4 are basically filled with ceramic,aluminum oxide and other composite materials,which have the advantages of heat resistance,thermal conductivity and heat dissipation.They are mainly used in high-power electronic products,and are mostly designed for multi-layer thick copper boards.This paper mainly studies and solves the problems in the production process of this kind of materials,such as lamination reliability,drilling burr,residue glue of laser blind holes,etc.

关 键 词：导热材料 多层厚铜板 可靠性 钻孔毛刺 

分 类 号：TN41[电子电信—微电子学与固体电子学]