谈一种埋置铜块的连片板制作方法  

A method of making board with copper embedded in plate

作　　者：蒋华 郭宇 谢易松 张亚锋 沈水红 Jiang Hua;Guo Yu;Xie Yisong;Zhang Yafeng;Shen Shuihong

机构地区：[1]胜宏科技(惠州)股份有限公司,广东惠州516211

出　　处：《印制电路信息》2021年第6期31-35,共5页Printed Circuit Information

摘　　要：埋铜板连片的生产过程,需要重点管控埋铜板的叠构、埋铜板连片的制作流程、铜块的蚀刻工艺、埋铜板的压合工艺、铜块与线路图形的匹配、压合后有无缺胶、皱褶异常、线路图形与铜块错位等问题。本文通过对埋铜板连片的生产流程进行研究,并总结出一种能适合此类型板生产的制作流程。In the production process of board with copper embedded,it is necessary to focus on controlling the stack-up,the production process of embedded copper in panel,the etching process of copper blocks,the pressing process of embedded copper,the matching of copper blocks and pattern on copper layers,and needs to consider if there will be problems such as the lacking of glue after pressing,the abnormal wrinkle,the dislocation of pattern on copper layers and pedestal etc.This paper mainly studies the production process of boards with embedded copper in panel and summarizes a production process suitable for this type of board production.

关 键 词：埋铜板 连片板 铜块 

分 类 号：TN41[电子电信—微电子学与固体电子学]