导热聚酰亚胺绝缘薄膜材料的研究进展  

Research Progress in Thermally Conductive and Insulating Polyimide Films

作　　者：高梦岩 王畅鸥 贾妍 翟磊[1] 莫松[1] 何民辉[1] 范琳[1,2] GAO Mengyan;WANG Chang’ou;JIA Yan;ZHAI Lei;MO Song;HE Minhui;FAN Lin(Key Laboratory of Science and Technology on High-tech Polymer Materials,Chinese Academy of Sciences,Beijing 100190,China;School of Chemical Sciences,University of Chinese Academy of Sciences,Beijing 100049,China)

机构地区：[1]中国科学院化学研究所极端环境高分子材料重点实验室,北京100190 [2]中国科学院大学化学科学学院,北京100049

出　　处：《绝缘材料》2021年第6期1-9,共9页Insulating Materials

基　　金：北京市自然科学基金资助项目(2202068)。

摘　　要：随着先进电子及高频通信技术的发展,聚酰亚胺薄膜作为重要的聚合物绝缘材料面临越来越高的导热性能要求。传统聚酰亚胺薄膜的本征导热系数较低,无法满足电子元器件的快速散热需求。近年来,研究人员对导热聚酰亚胺薄膜材料开展了大量研究,通过加入无机导热填料获得了具有良好导热性能的聚酰亚胺基复合薄膜。本文综述了国内外在导热聚酰亚胺绝缘薄膜材料方面的最新研究进展,详细讨论了聚酰亚胺/导热填料复合薄膜的导热行为,系统阐述了导热性能的影响因素,包括填料类型、尺寸、加入量、填料与基体的界面相互作用等,并对高性能聚酰亚胺基导热绝缘薄膜材料面临的技术挑战进行了总结与展望。With the development of advanced electronics and high frequency communication technology,polyimide(PI)film faces more and more high thermal conductivity requirements as an important polymer insulating material.The intrinsic thermal conductivity of traditional PI film is smaller,which cannot meet the rapid cooling requirement of electronic components.In recent years,researchers had carried out a lot of researches on thermally conductive PI films and a series of polyimide-based composite films were prepared by adding inorganic thermally conductive fillers.In this paper,we summarized the latest research progress in thermally conductive PIbased insulating films and discussed the relevant thermal conduction behavior.The key factors influencing the thermal conductivity of films,which include fillers types,particle sizes,addition amount,and the interface interaction between fillers and polyimide matrix,were described systematically.In addition,the technical challenges of high performance polyimide-based thermally conductive insulating film materials were summarized and proposed.

关 键 词：聚酰亚胺 复合薄膜 导热性能 填料 界面相互作用 

分 类 号：TM215.3[一般工业技术—材料科学与工程]