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作 者:王锐[1] 钱吉裕[1] 魏涛[1] 黄豪杰 WANG Rui;QIAN Jiyu;WEI Tao;HUANG Haojie(Nanjing Research Institute of Electronics Technology,Nanjing 210039,China)
出 处:《电子机械工程》2021年第3期28-31,64,共5页Electro-Mechanical Engineering
摘 要:随着射频电子装备不断向高集成度和大功率方向发展,传统开式循环冷却技术已不能满足系统微型化及高热流密度散热需求,急需发展闭式循环片上冷却技术。微泵是闭式冷却系统的核心部件,而目前微流控泵的性能与射频微系统大流量、高扬程的需求存在量级差异,因此亟待明确射频微系统微泵的发展方向,研制符合要求的高性能微泵,以解决射频微系统散热瓶颈,破除射频微系统性能提升的限制壁垒。With the development of radio frequency(RF)electronic equipment towards high integration and high power,the traditional open cycle cooling technology can’t meet the requirements of system miniaturization and high heat flux.A closed-cycle on-chip cooling technology must be developed.The micropump is the core component of the closed cooling system,while the performance of the current microfluidic pumps differs from the requirements of high flow and high lift in RF microsystems by an order of magnitude.Therefore,it is urgent to clarify the development direction of micropumps and develop micropumps with good performance in order to solve the bottleneck of heat dissipation and break the barriers of performance improvement of the RF microsystem.
分 类 号:TK414.211[动力工程及工程热物理—动力机械及工程]
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