Die sinter bonding in air using copper formate preform for formation of full-density bondline  

用甲酸铜预制块在空气中模压烧结形成全致密黏结层

作　　者：Yun-Ju LEE Jong-Hyun LEE 

机构地区：[1]Department of Materials Science and Engineering,Seoul National University of Science and Technology,232 Gongneung-ro,Nowon-gu,Seoul 139-743,Korea

出　　处：《Transactions of Nonferrous Metals Society of China》2021年第6期1717-1728,共12页中国有色金属学报（英文版）

基　　金：supported by the Materials&Components Technology Development Program(10080187)funded by the Ministry of Trade,Industry&Energy(MI,Korea)。

摘　　要：Pressure-assisted sinter bonding was performed in air at 250−350℃ using a preform comprising copper formate particles to form a bondline that is sustainable at high temperatures.H2 and CO generated concurrently by the pyrolysis of copper formate at 210℃ during the sinter bonding removed the native oxide and other oxides grown on bulk Cu finishes,enabling interface bonding.Moreover,Cu produced in situ by the reduction of Cu(II)accelerated the sinter bonding.Consequently,the bonding achieved at 300−350℃ under 5 MPa exhibited sufficient shear strength of 20.0−31.5 MPa after 180−300 min of sinter bonding.In addition,an increase in pressure to 10 MPa resulted in shear strength of 21.9 MPa after an extremely short time of 30 s at 250℃,and a near-full-density bondline was achieved after 300 s.The obtained results indicate the promising potential of the preform comprising copper formate particles for high-speed sinter bonding.使用由甲酸铜颗粒组成的预制块,在250~350℃于空气中用压力辅助烧结法制备耐高温的黏结层。烧结过程中,甲酸铜在210℃发生热解,同时生成H2和CO,且去除铜块体表面的天然氧化物和其他生成的氧化物,形成界面结合。而且,原位还原Cu(Ⅱ)生成的Cu加速烧结连接。在300~350℃和5 MPa压力下烧结180~300 s后得到的黏结层具有足够的剪切强度:20.0~31.5 MPa。此外,在250℃条件下,当压力增加到10 MPa时,在极短的时间(30 s)内,剪切强度达到21.9 MPa,300 s后形成接近全致密的黏结层。因此,甲酸铜颗粒预制块在高速烧结连接中具有广阔的应用前景。

关 键 词：structural materials microstructure mechanical properties copper formate preform sinter bonding PYROLYSIS 

分 类 号：TF046.4[冶金工程—冶金物理化学]