烧结温度与时间对高锡含铟银基钎料焊接性能和组织的影响  

Effects of Sintering Temperature and Time on Welding Properties and Microstructure of High Sn In-Containing Silver Based Solder

作　　者：杨凌志 胡建华[1] 张婕 王跃申 YANG Lingzhi;HU Jianhua;ZHANG Jie;WANG Yueshen(School of Materials Science and Engineering,Wuhan University of Technology,Wuhan 430070,China)

机构地区：[1]武汉理工大学材料科学与工程学院,湖北武汉430070

出　　处：《热加工工艺》2021年第11期38-44,共7页Hot Working Technology

摘　　要：采用电磁压制方式制备高锡含铟银基钎料用坯,并改变放电参数得到不同致密度的钎料压坯,然后采用不同的液相烧结工艺制备钎料。通过紫铜对接钎焊和T型钎焊试验研究烧结温度与时间对高锡含铟银基钎料焊接性能和组织的影响,并通过SEM显微组织观察、显微硬度测试、接头剥离强度测试等方法对钎焊接头的性能进行评定。结果表明:在电磁压制过程中,当电容值一定时,随着电压值的升高,钎料箔片的致密度越大;当电压值一定时,随着电容值增大,钎料箔片的致密度增大,但增大幅度较小;在烧结过程中,当保温时间一定时,随着烧结温度的升高,对接接头的显微硬度增大,T型接头的剥离强度增大;当烧结温度一定时,随着烧结时间增加,对接接头的显微硬度减小,T型接头的剥离强度降低。The blank of high Sn, In-containing Ag based solder was prepared by electromagnetic compaction, and the blanks with different density were obtained by changing the discharge parameters. Then the solder was prepared by different liquid phase sintering process. The effects of sintering temperature and time on the weldability and microstructure of high Sn In-containing silver based solder were studied by butt and T-type brazing tests, and the properties of the brazed joints were evaluated by SEM, microhardness and peel strength tests. The results show that: in the electromagnetic pressing process, when the capacitance value is fixed, the density of solder foil increases with the increase of voltage value;when the voltage value is fixed, the density of solder foil increases with the increase of capacitance value, but the increase range is small. In the sintering process, when the holding time is fixed, the microhardness of butt joint increases with the increase of sintering temperature,and the peel strength of T-joint increases;when the sintering temperature is fixed, the microhardness of butt joint decreases with the increase of sintering time, and the peel strength of T-joint decreases.

关 键 词：电磁压制 银基钎料 致密度 焊接性能 

分 类 号：TG425[金属学及工艺—焊接]