多层瓷介电容器端电极制备工艺对端电极附着力影响研究  

Effect of dipping and sintering process on MLCC terminal electrode adhesion

作　　者：侯喜路 秦英德 杨秀玲 卫冬娟 唐文泽 HOU Xilu;QIN Yingde;YANG Xiuling;WEI Dongjuan;TANG Wenze(Chengdu Hongke Electronic Technology Co.,Ltd.,Chengdu 610100,China)

机构地区：[1]成都宏科电子科技有限公司,四川成都610100

出　　处：《电子元件与材料》2021年第6期524-529,535,共7页Electronic Components And Materials

摘　　要：研究了多层瓷介电容器(MLCC)端电极制备环节中产品翻边宽度、端电极底银层厚度、烧端峰值温度、峰值温度保温时间及烧端装载密度对产品端电极附着力的影响。结果显示,随着翻边宽度和底银层厚度的增加,产品相应的端面结合强度随之提升,当翻边宽度为0.5 mm、底银层厚度为26μm左右时,产品的抗弯曲性能>8 mm,平均极限抗剪切力为165.17 N;烧端峰值温度、峰值温度保温时间及烧端装载密度对产品端电极附着力具有明显影响,800℃烧端峰值温度、15 min峰值温度保温时间、1.2只/cm^(2)装载密度制备的样品具备最优的抗弯曲和抗剪切性能,产品抗弯曲性能可达8 mm以上,平均极限抗剪切力可达165.23 N。The effects of dipping process and Ag-sintering process of MLCC end electrode preparation were investigated.The results show that MLCC bending strength and shearing strength properties both increase as Ag-turnup width and Agthickness increases.In general,MLCC prepared with 0.5 mm Ag-turnup width and 26μm Ag-thickness exhibits greater than 8 mm bending height and 165.17 N average shearing force.Sintering loading density,sintering peak temperature and peak temperature duration all have significant effects on the adhesion of MLCC end electrode.MLCC was prepared with 1.2 per square centimeter loading density and sintered at 800℃for 15 min,which bending height and average shearing force properties could exceed 8 mm and 165.23 N,respectively.

关 键 词：MLCC 峰值温度 保温时间 装载密度 抗弯强度 抗剪切强度 

分 类 号：TM534[电气工程—电器]