含烷基取代基柔性聚酰亚胺薄膜的制备  

Flexible Polyimide Film Containing Alkyl Substituents

作　　者：王刚[1,2] 蔡才 卢春燕 汪海平 朱天容[1] 胡思前[1,2] WANG Gang;CAI Cai;LU Chun-yan;WANG Hai-ping;ZHU Tian-rong;HU Si-qian(Key Laboratory of Optoelectronic Chemical Materials and Devices,Ministry of Education,Jianghan University,Wuhan 430056,China;School of Chemical and Environmental Engineering,Jianghan University,Wuhan 430056,China)

机构地区：[1]江汉大学光电化学材料与器件教育部重点实验室,湖北武汉430056 [2]江汉大学化学与环境工程学院,湖北武汉430056

出　　处：《塑料工业》2021年第6期23-25,77,共4页China Plastics Industry

基　　金：国家高技术研究发展计划(“863”项目)(2015AA033406);武汉市人才培养计划(20141822);光电化学材料与器件教育部重点实验室开放基金(江汉大学)(JDGD-201711)。

摘　　要：以柔性二胺单体1,3-双(4-氨基苯氧基)苯(134BAPB)和含支链二胺单体3,3′-二乙基-4,4′-二氨基二苯甲烷(DEMMD)与3,3′,4,4′-二苯酮四酸二酐(BTDA)进行三元共聚,制备了一系列聚酰亚胺(PI)薄膜。通过傅里叶红外光谱、差示扫描量热仪、热重分析仪、热机械分析仪及电子万能材料试验机对材料的结构、热性能和力学性能进行了表征。结果表明PI薄膜已经成功制备,热性能与力学性能良好。Based on flexible diamine monomer 1,3-bis(4-aminophenoxy)benzene(134 BAPB),branched diamine monomer 3,3′-diethyl-4,4′-diaminodiphenylmethane(DEMMD)and 3,3′,4,4′-benzophenonetetracarboxylic dianhydride(BTDA)were ternary copolymerized to prepare a series of polyimide(PI)films.The structure,thermal and mechanical properties of the material were characterized by Fourier infrared spectroscopy,differential scanning calorimeter,thermogravimetric analyzer,thermomechanical analyzer and electronic universal material testing machine.The results show that the PI film has been successfully prepared with good thermal and mechanical properties.

关 键 词：聚酰亚胺 薄膜 柔性 三元共聚 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]