基于棋盘型高拓扑热沉结构不同喷嘴射流分布结构的数值研究  

Numerical investigation of different nozzle-jet distributions based on chessboard high-topology composite heat sink

作　　者：石千磊 刘倩 李凯璇 巨星[1] 徐超[1] SHI QianLei;LIU Qian;LI KaiXuan;JU Xing;XU Chao(School of Energy Power and Mechanical Engineering,North China Electric Power University,Beijing 102206,China)

机构地区：[1]华北电力大学能源动力与机械工程学院,北京102206

出　　处：《中国科学：技术科学》2021年第6期699-710,共12页Scientia Sinica(Technologica)

基　　金：国家自然科学基金(批准号:51876062);中央高校基本科研业务费专项资金(编号:2019MS017)资助项目。

摘　　要：电子或电力电子芯片的高密度热流换热问题是制约芯片技术的核心问题之一.本文针对棋盘型喷嘴射流/歧管/微针翅复合结构拓扑形态设计和几何构造参数影响关系进行数值模拟研究.建立喷嘴阵列在正方形、正六边形和菱形三种拓扑结构下换热单元的计算模型,分析各拓扑结构不同参数尺度的流动换热性能.计算结果表明,当射流孔和微针翅的直径分别为50和100μm时,正六边形喷嘴阵列拓扑下复合换热结构压降较小,但换热效果也受到局限;菱形喷嘴阵列拓扑虽然具有最高的局部对流换热系数(>150000 W/(Km^(2))),但微针翅表面的换热系数较低,温度分布的不均匀程度较大;正方形喷嘴阵列拓扑下热沉的性能具有显著优势,压降仅3150 Pa时,总热阻低至0.099×10^(-4)Km^(2)/W.该复合热沉结构具有高拓扑性,易于与不同形状大小的芯片相结合,在进一步降低结构尺度和接触热阻后,将在高热流密度芯片冷却领域展示出更好的应用潜力.The ultrahigh heat flux removal of chips is a core issue that restricts chip technology. This work focuses on the topological design of the chessboard nozzle-jet/manifold/micropin-fin composite heat sink and investigates the influence of geometric parameters through numerical studies. A simulation model of a heat exchange unit with different nozzle arrays in square, regular hexagon and diamond shapes, is proposed, furthermore, flow and heat transfer performance in different geometric parameters are analyzed. Numerical results show that when the diameter of the nozzle and micropin-fin is 50 and 100 μm, respectively, the pressure drop of the regularhexagon nozzle distribution is small, but the heat transfer performance is limited. By contrast, the diamond nozzle distribution has the highest local convective heat transfer coefficient(>150000 W/(Km^(2))), whereas the heat transfer coefficient on the surface of the micropin-fin is low, resulting in temperature maldistribution. The performance of the heat sink under square distribution has remarkable advantages. When the pressure drop is only 3150 Pa, the total thermal resistance reaches as low as 0.099×10^(-4)Km^(2)/W.The composite structure has merits of easy combination with chips of different forms for the further reduction of contact thermal resistance by structural scale reduction, thus, it has good application potential in the cooling of high-heat flux chips.

关 键 词：高热流密度 复合热沉 微针翅 歧管 喷嘴射流 

分 类 号：TN40[电子电信—微电子学与固体电子学] TK124[动力工程及工程热物理—工程热物理]